B37941K5104K070 EPCOS Inc, B37941K5104K070 Datasheet - Page 24

CAP CERM .10UF 50V X7R 10% 0805

B37941K5104K070

Manufacturer Part Number
B37941K5104K070
Description
CAP CERM .10UF 50V X7R 10% 0805
Manufacturer
EPCOS Inc
Series
B37941Kr
Datasheet

Specifications of B37941K5104K070

Capacitance
0.1µF
Voltage - Rated
50V
Tolerance
±10%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Applications
Automotive
Ratings
AEC-Q200
Package / Case
0805 (2012 Metric)
Size / Dimension
0.079" L x 0.049" W (2.00mm x 1.25mm)
Thickness
1.25mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Spacing
-
Other names
B37941K5104K 70
B37941K5104K70

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
B37941K5104K070
Manufacturer:
TDK-EPCOS-TDK
Quantity:
60 000
The following should be considered in the placement process
10. When soldering the most gentle solder profile feasible should be selected (heating time, peak
11. Ensure the correct solder meniscus height and solder quantity.
12. Ensure correct dosing of the cement quantity.
13. Ceramic capacitors with an AgPd external termination are not suited for the lead-free solder
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
1. Ensure correct positioning of the ceramic capacitor on the solder pad.
2. Caution when using casting, injection-molded and molding compounds and cleaning agents,
3. Support the circuit board and reduce the placement forces.
4. A board should not be straightened (manually) if it has been distorted by soldering.
5. Separate panels with a peripheral saw, or better with a milling head (no dicing or breaking).
6. Caution in the subsequent placement of heavy or leaded components (e.g. transformers or
7. When testing, transporting, packing or incorporating the board, avoid any deformation of the
8. Avoid the use of excessive force when plugging a connector into a device soldered onto the
9. Ceramic capacitors must be soldered only by the mode (reflow or wave soldering) permissible
Multilayer ceramic capacitors
Cautions and warnings
as these may damage the capacitor.
snap-in components): danger of bending and fracture.
board not to damage the components.
board.
for them (see the chapter “Soldering directions”).
temperature, cooling time) in order to avoid thermal stresses and damage.
process: they were developed only for conductive adhesion technology.
23
10/06

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