LMK432BJ226MM-T Taiyo Yuden, LMK432BJ226MM-T Datasheet

CAP CER 22UF 10V X5R 1812

LMK432BJ226MM-T

Manufacturer Part Number
LMK432BJ226MM-T
Description
CAP CER 22UF 10V X5R 1812
Manufacturer
Taiyo Yuden
Series
LMKr
Datasheet

Specifications of LMK432BJ226MM-T

Capacitance
22µF
Voltage - Rated
10V
Tolerance
±20%
Temperature Coefficient
X5R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 85°C
Applications
General Purpose
Package / Case
1812 (4532 Metric)
Size / Dimension
0.177" L x 0.126" W (4.50mm x 3.20mm)
Thickness
2.50mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Ratings
-
Lead Spacing
-
Other names
587-1408-2
CE LMK432 BJ226MM-T
38
大容量積層セラミ ックコンデンサ
HIGH VALUE MULTILAYER CERAMIC
CAPACITORS
Y電極にNi金属を使用し、端子電極部にメッキをしてあることにより、はん
Y等価直列抵抗fESRgが小さく、ノイズ吸収性にすぐれています。特にタン
Y高い許容リップル電流値
Y高い定格電圧でありながら小型形状
Y絶縁抵抗、破壊電圧が高く信頼性にすぐれる
Yデジタル回路全般
Y電源バイパスコンデンサ
Y平滑コンデンサ
1
定格電圧 hVDCi
2
シリーズ名
1
Rated voltagehVDCi
2
Series name
だ付け性および耐熱性にすぐれ、マイグレーションもほとんど発生せず、
高い信頼性を示します
タルおよびアルミ電解コンデンサに比較した場合
等の特徴があります
液晶モジュール用
液晶駆動電圧ライン用
電源電圧の高いLSI、IC、OPアンプ用
DC-DCコンバータf入力、出力側用g
スイッチング電源f2次側用g
特長 FEATURES
用途 APPLICATIONS
形名表記法 ORDERING CODE
M
A
E
G
U
J M K 3 1 6 B J 1 0 6 M L _ T Z
A
E
G
U
J
L
T
J
L
T
M
1
Multilayer Ceramic Capacitors
積層コンデンサ
2
10
16
25
35
50
10
16
25
35
50
4
6.3
4
6.3
OPERATING TEMP.
3
端子電極
形状寸法 hEIAiLPWfmmg
End termination
Dimensionshcase sizeifmmg
3
4
3
4
107f0603g
212f0805g
316f1206g
325f1210g
432f1812g
107f0603g
212f0805g
316f1206g
325f1210g
432f1812g
K
K
4
code
BJ
C
E
F
メッキ品
Plated
1.6P0.8
2.0P1.25
3.2P1.6
3.2P2.5
4.5P3.2
1.6P0.8
2.0P1.25
3.2P1.6
3.2P2.5
4.5P3.2
Temp.characteristics
X7R
X5R
X5S
X6S
Y5U
Y5V
C
B
E
F
example
温度特性 hLi
6
公称静電容量 hpFi
Temperature characteristics code
6
Nominal capacitancehpFi
5
5
QC
QE
473
105
5
QC
QC
QE
473
105
QF
B J
QF
B J
B J
operating Temp. range
K25VJ85C
K55VJ125C
K55VJ85C
K25VJ85C
K55VJ85C
K55VJ105C
K25VJ85C
K30VJ85C
K25VJ85C
K30VJ85C
X7R
X5R
Y5U
Y5V
X5S
X6S
1,000,000
1,000,000
K30VJ85C
J22NK82L
K55VJ125C
M15L
K55VJ85C
M15L
K55VJ85C
M22L
K55VJ105C
M22L
K30VJ85C
M22NK56L
QWBlank space
M20
M10
47,000
47,000
J30
K80
J20
K55
20
QW スペース
YThe use of Nickel(Ni) as material for both the internal and external elec-
YLow equivalent series resistance(ESR) provides excellent noise absorp-
YCompared to tantalum or aluminum electrolytic capacitors these ceramic
YGeneral digital circuit
YPower supply bypass capacitors
YSmoothing capacitors
trodes improves the solderability and heat resistance characteristics. This
almost completely eliminates migration and raises the level of reliability
significantly.
tion characteristics.
capacitors offer a number of excellent features, including:
Liquid crystal modules
Liquid crystal drive voltage lines
LS I, I C, converters(both for input and output)
DC-DC converters (both for input and output)
Switching power supplies (secondary side)
6
Higher permissible ripple current values
Smaller case sizes relative to rated voltage
Improved reliability due to higher insulation resistance and break-
down voltage.
容量許容差
8
製品厚み hmmi
Capacitance toleranceshLi
8
Thicknesshmmi
7
7
M
K
V
A
D
G
H
N
Y
M
U
M
G
M
K
Z
F
L
K
Z
K
V
A
D
F
H
L
N
Y
U
7
M10
M20
1.15
1.25
M10
M20
0.45
0.5
0.8
0.85
1.5
1.6
1.9
2.0max
2.5
3.2
0.45
0.5
0.8
0.85
1.15
1.25
1.5
1.6
1.9
2.0max
2.5
3.2
J80
K20
J80
K20
8
%
%
%
10
11
10
11
Internal code
9
個別仕様
包装
当社管理記号
9
9
Special code
Packaging
Q
K
Q
K
B
T
B
T
10
Standard products
Standard products
リールテーピング
単品 f 袋づめ g
Tape & reel
QWBlank space
標準品
標準
Bulk
QW スペース
11

Related parts for LMK432BJ226MM-T

LMK432BJ226MM-T Summary of contents

Page 1

... YLow equivalent series resistance(ESR) provides excellent noise absorp- tion characteristics. YCompared to tantalum or aluminum electrolytic capacitors these ceramic capacitors offer a number of excellent features, including: Higher permissible ripple current values Smaller case sizes relative to rated voltage Improved reliability due to higher insulation resistance and break- down voltage ...

Page 2

... A 6.8 685 10 106 A 22 226 47 476 100 107 220 227 ■低背積層セラミックコンデンサ Low profile Multilayer Ceramic Capacitors Cap Type 107 TC B/X5R X5R F/Y5V B/X7R VDC 10 6.3 6.3 4 6.3 ...

Page 3

... Low profile Multilayer Ceramic Capacitors アイテム一覧 PART NUMBERS (0603 case size) F107TYPE 定 格 形  名 ...

Page 4

PART NUMBERS (0603 case size) F212TYPE 定 格 形  名 電 圧 RatedVoltage Ordering code UMK21 23GD UMK21 33GD UMK21 73GG UMK21 83GG 50V UMK21 04GG UMK21 ...

Page 5

PART NUMBERS (0603 case size) F316TYPE 定 格 形  名 電 圧 RatedVoltage Ordering code UMK31 4GF 50V UMK31 4GL UMK31 4GL GMK31 4GL 35V GMK31 ...

Page 6

PART NUMBERS (0603 case size) F325TYPE 定 格 形  名 電 圧 RatedVoltage Ordering code UMK325 5GH 50V GMK325 5MN 35V TMK325 5MD TMK325 5MH TMK325 5MN ...

Page 7

... CHARACTERISTICS インピーダンスYESR–周波数特性例 Example of Impedance ESR vs. Frequency characteristics Y当社積層セラミックコンデンサ例 (Taiyo Yuden multilayer ceramic capacitor) LMK107F105Z ...

Page 8

CHARACTERISTICS JMK212BJ106M LMK432BJ226M TMK107 C105M LMK212BJ105K TMK316 C106M LMK212BJ225M 4 JMK432C107M 45 ...

Page 9

Minimum Quantity F袋づめ梱包 Bulk packaging  製品厚み 形式fEIAg Thickness Type mmfinchg 0.5 GMK105f0402g f0.020g GVK105f0402g 0.8 GMK107f0603g f0.031g 0.8 f0.031g G2K110f0504g 0.6 f0.024g 0.85 f0.033g GMK212f0805g 1.25 f0.049g 0.85 G4K212f0805g f0.033g 0.85 G2K212f0805g f0.033g 0.85 f0.033g 1.15 f0.045g GMK316f1206g ...

Page 10

Tape ( 8mm幅) f0.315inches wideg                     Type チップ挿入部 挿入ピッチ Chip Cavity Insertion Pitch Tape Thickness fEIAg A B 0.37M0.065 0.67M0.065 52.0M0.05 GMK063f0201g f0.06M0.002g f0.027M0.002g f0.079M0.002g f0.018max.g 0.65M0.15 1.15M0.15 52.0M0.05 GMK105f0402g GVK105f0402g f0.026M0.004g f0.045M0.004g f0.079M0.002g f0.031max.g 1.0M0.2 1.8M0.2 ...

Page 11

... RELIABILITY DATA Multilayer Ceramic Capacitor Chips Item Temperature Compensating (Class 1) Standard High Frequency Type 1.Operating Temperature K55 to J125C Range K55 to J125C Range 3.Rated Voltage 50VDC,25VDC, 16VDC 16VDC 50VDC 4.Withstanding Voltage No breakdown or dam- No abnormality Between terminals age 5.Insulation Resistance 10000 ME min. 6.Capacitance (Tolerance) ...

Page 12

... RELIABILITY DATA Multilayer Ceramic Capacitor Chips Item Temperature Compensating (Class 1) Standard High Frequency Type 10.Body Strength No mechanical dam- age. 11.Adhesion of Electrode No separation or indication of separation of electrode. 12.Solderability At least 95% of terminal electrode is covered by new solder. 13.Resistance to soldering Appearance: No abnor- Appearance: No abnor- mality mality ...

Page 13

... RELIABILITY DATA Multilayer Ceramic Capacitor Chips Item Temperature Compensating (Class 1) Standard High Frequency Type 16.Loading under Damp Heat Appearance: No abnor- Appearance: No abnor- mality mality Capacitance change: Capacitance change CT2 pF: Within M0.4 pF M0.75pF, whichever is CX2 pF: Within M0.75 larger CU30 pF: QU200 CD Nominal capaci- C< ...

Page 14

... PRECAUTIONS Precautions on the use of Multilayer Ceramic Capacitors Stages Precautions 1.Circuit Design Verification of operating environment, electrical rating and per- formance 1. A malfunction in medical equipment, spacecraft, nuclear re- actors, etc. may cause serious harm to human life or have severe social ramifications. As such, any capacitors to be ...

Page 15

... PRECAUTIONS Precautions on the use of Multilayer Ceramic Capacitors Stages Precautions 2.PCB Design Pattern configurations (Capacitor layout on panelized [breakaway] PC boards) 1. After capacitors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufac- turing processes (PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered boards etc ...

Page 16

... PRECAUTIONS Precautions on the use of Multilayer Ceramic Capacitors Stages Precautions 3.Considerations for auto- Adjustment of mounting machine matic placement 1. Excessive impact load should not be imposed on the capaci- tors when mounting onto the PC boards. 2. The maintenance and inspection of the mounters should be conducted periodically. Selection of Adhesives 1 ...

Page 17

... Preheating when soldering Heating: Ceramic chip components should be preheated to within 100 to 130C of the sol- dering. Cooling: The temperature difference between the components and cleaning process should not be greater than 100C ...

Page 18

... Mechanical considerations 1. Be careful not to subject the capacitors to excessive mechani- cal shocks. (1)If ceramic capacitors are dropped onto the floor or a hard surface, they should not be used. (2)When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components ...

Page 19

... YCeramic chip capacitors should be kept where no chlorine or sulfur exists in the air. 2. The capacitance value of high dielectric constant capacitors (type 2 &3) will gradually decrease with the passage of time, so this should be taken into consideration in the circuit design ...

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