SMX1J7.5A-TR STMicroelectronics, SMX1J7.5A-TR Datasheet
SMX1J7.5A-TR
Specifications of SMX1J7.5A-TR
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SMX1J7.5A-TR Summary of contents
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... SMPS where low leakage current and high junction temperature are required to provide reliability and stability over time. The SMX1J is packaged in µQFN-2L. October 2010 Figure TM: Transil is a trademark of STMicroelectronics Doc ID 16180 Rev 3 SMX1J Transil™ µQFN-2L Functional diagram (top view) www ...
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... Table 2. Electrical characteristics - parameter values (T I max Type 25 °C 85 °C µA V SMX1J7. 7.5 1. Pulse test : t < Surge capability given for both directions for unidirectional and bidirectional types 3. To calculate maximum clamping voltage at other surge level, use the following formula CLmax PPappli 4 ...
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SMX1J Figure 4. Peak pulse power dissipation versus initial junction temperature P (W) PP 100.0 90.0 80.0 70.0 60.0 50.0 40.0 30.0 20.0 10.0 0 100 Figure 6. Clamping voltage versus peak pulse current (exponential waveform, ...
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Ordering information scheme 2 Ordering information scheme Figure 10. Ordering information scheme Surface Mount Package X = µQFN-2L Peak Pulse Power 1 = 100 W (typical value) Stand off voltage 7.5 = 7.5 V Type A = Unidirectional Delivery mode ...
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SMX1J 3 Package information ● Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 ● Flammability: Epoxy is rated UL94V-0 ● RoHS package In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending ...
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Package information Figure 13. Tape and reel specifications 6/11 Doc ID 16180 Rev 3 SMX1J ...
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SMX1J 4 Recommendation on PCB assembly 4.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 14. Stencil opening dimensions b) General design rule Stencil thickness (T) = ...
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Recommendation on PCB assembly 4.2 Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. Solder paste without cleaning flux is recommended. 3. Offers a high tack force to resist component movement during high speed. 4. Solder paste with ...
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SMX1J 4.5 Reflow profile Figure 16. ST ECOPACK® recommended soldering reflow profile for PCB mounting Temperature (°C) Temperature (°C) 260°C max 260°C max 255°C 255°C 220°C 220°C 180°C 180°C 125 °C 125 ° Note: Minimize air ...
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... Ordering information 5 Ordering information Table 4. Ordering information Order code SMX1J7.5A-TR 6 Revision history Table 5. Document revision history Date 26-Oct-2009 03-Nov-2009 27-Oct-2010 10/11 Marking Package Weight L µQFN-2L 2.3 mg Revision 1 First issue. 2 Updated : Features, 3 Updated base quantity Doc ID 16180 Rev 3 Base qty Delivery mode ...
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... SMX1J Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...