ESD9R3.3ST5G ON Semiconductor, ESD9R3.3ST5G Datasheet

TVS ESD ULT LOW CAP SOD-923

ESD9R3.3ST5G

Manufacturer Part Number
ESD9R3.3ST5G
Description
TVS ESD ULT LOW CAP SOD-923
Manufacturer
ON Semiconductor
Datasheet

Specifications of ESD9R3.3ST5G

Voltage - Reverse Standoff (typ)
3.3V
Voltage - Breakdown
4.8V
Power (watts)
150mW
Polarization
Unidirectional
Mounting Type
Surface Mount
Package / Case
SOD-923
Polarity
Unidirectional
Clamping Voltage
7.8 V
Operating Voltage
3.3 V
Breakdown Voltage
4.8 V
Termination Style
SMD/SMT
Peak Surge Current
1 A
Capacitance
0.5 pF
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 55 C
Dimensions
0.6 mm W x 0.8 mm L
Reverse Stand-off Voltage Vrwm
3.3V
Clamping Voltage Vc Max
7.8V
Diode Configuration
Unidirectional
Peak Pulse Current Ippm
1A
Diode Case Style
SOD-923
No. Of Pins
2
Power Dissipation Pd
150mW
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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ESD9R3.3ST5G
Transient Voltage
Suppressors
ESD Protection Diodes with Ultra−Low
Leakage
ASICs used in ultra low current applications such as human body sensors.
These devices have been designed for leakage under 1 nA from 0°C to
50°C when turned off. During an ESD event, these devices turn on to
clamp the ESD to a safe voltage level for the IC. These devices have the
added benefits of low capacitance for high speed data lines and small
package size for space constrained designs.
Specification Features:
Mechanical Characteristics:
CASE:
Epoxy Meets UL 94 V−0
LEAD FINISH:
MOUNTING POSITION:
QUALIFIED MAX REFLOW TEMPERATURE:
Device Meets MSL 1 Requirements
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
© Semiconductor Components Industries, LLC, 2008
July, 2008 − Rev. 0
MAXIMUM RATINGS
IEC 61000−4−2 (ESD)
HBM
Total Power Dissipation on FR−5 Board
Storage Temperature Range
Junction Temperature Range
Lead Solder Temperature − Maximum
The ESD9R is designed to provide ESD protection for ASSPs and
Ultra−Low Leakage < 1 nA
Ultra−Low Capacitance 0.5 pF
Low Clamping Voltage
Small Body Outline Dimensions:
Low Body Height: 0.016″ (0.4 mm)
Stand−off Voltage: 3.3 V
Response Time < 1.0 ns
IEC61000−4−2 Level 4 ESD Protection
This is a Pb−Free and Halogen−Free Device
(Note 1) @ T
(10 Second Duration)
0.039″ x 0.024″ (1.00 mm x 0.60 mm)
Void-free, transfer-molded, thermosetting plastic
A
100% Matte Sn (Tin)
Rating
= 25°C
Any
Contact
Air
Symbol
°P
T
T
T
stg
D
L
J
°
260°C
−55 to +150
−55 to +125
Value
±10
±15
±16
150
260
1
Unit
mW
kV
°C
°C
°C
†For information on tape and reel specifications,
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 2 of this data sheet.
ESD9R3.3ST5G
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*Date Code orientation and/or position may
vary depending upon manufacturing location.
Device
DEVICE MARKING INFORMATION
ORDERING INFORMATION
J
M = Date Code
MARKING DIAGRAM
http://onsemi.com
= Specific Device Code
CASE 514AB
SOD−923
Package
SOD−923
J M
Publication Order Number:
8000/Tape & Reel
Shipping
ESD9R3.3S/D

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ESD9R3.3ST5G Summary of contents

Page 1

... FR−5 = 1.0 x 0.75 x 0.62 in. See Application Note AND8308/D for further description of survivability specs. © Semiconductor Components Industries, LLC, 2008 July, 2008 − Rev. 0 260°C ESD9R3.3ST5G Symbol Value Unit †For information on tape and reel specifications, including part orientation and tape sizes, please ± ...

Page 2

... Application Note AND8308/D for detailed explanations of datasheet parameters. ELECTRICAL CHARACTERISTICS V RWM (V) Device Marking Max Device ESD9R3.3ST5G J* 3.3 *Rotated 270° measured with a pulse test current For test procedure see Figures 3 and 4 and Application Note AND8307/D. 4. Limits over temperature are guaranteed by design, not production tested measured using pulse waveform in Figure 5 ...

Page 3

... ON Semiconductor has developed a way to examine the entire voltage waveform across the ESD protection diode over the time domain of an ESD pulse in the form of an oscilloscope screenshot, which can be found on the datasheets for all ESD protection diodes ...

Page 4

... H E *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “ ...

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