3461-0041 3M, 3461-0041 Datasheet - Page 13

• Manufacturer Part Number: 3461-0041
• Description: CONN CARD EDGE POLAR KEY 20POS
• Manufacturer: 3M
• Series: 3000r

Specifications of 3461-0041

• Card Type: Dual Edge
• Card Thickness: 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
• Gender: Female
• Number Of Positions: 20
• Pitch: 0.100" (2.54mm)
• Number Of Rows: 2
• Mounting Type: Free Hanging (In-Line), IDC
• Features: Card Specific
• Contact Finish: Gold
• Contact Finish Thickness: 30µin (0.76µm)
• Color: Gray
• Rohs Compliant: Yes
• Product Type: Without Flanges
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 05400720133; 34610041; 5400720133; 54007201335; 80610159974

3M.com/interconnects
CF Card Headers, CompactFlash
CF Card Ejectors, CompactFlash
Attachment (SATA) Connectors
Serial Advanced Technology
Series 5607 and 5622
Serial Attached SCSI
Series SBR and SBH
(SAS) Connectors
product
Series N7E50
Series 7E50
™
™
connector SolutionS
3M
• RoHS Compliant
• Headers for Both Type
• Wide Array of Connector
• RoHS Compliant
• Mates to Selected N7E50
• Multiple Button Styles and
• RoHS Compliant
• 6.0 Gbps Input/Output Connector
• Two Contact Mating Levels for
• Capable of Accepting SFF-Compliant
• Elevated Receptacle Version for
• Plated Through-Hole, Press-Fit or
• Right Angle Version Available
• 29-Position Device Plugs for Drive
• 29-Position Combo with Power
• RoHS Compliant
• 3 Gbps I/O Connector
• EMLB Contacts for Hot Swap
• Blind Mate Polarization
• Meets SATA 2.6 Specifications
• Plated Through-Hole, Press-Fit or
• Extended Height Receptacles for
• Right Angle Surfacemount
• 7-Pin Signal Plug
• 22-Position Device Plugs for Drive
• 22-Position Combo wih Power
OPTIONS
OPTIONS
I and II Cards
Size Options to Balance
Between Footprint Size
and Functionality
Series CF Headers to Provide
Added Ejection Functionality
Orientations Allow
Design Flexibility
for Backplane Applications
Early-Mate and Late-Break
Allows “Blind Mating” or “Hot Swap”
Applications
HDD Fitted with SAS or Serial
Advanced Technology Attachment
(SATA) Header
Additional Backplane Stand-off
SMT Available
Interface
for HDD Applications
SMT Available
Additional Backplane Standoff
Receptacle
Interface
FeatureS
™
deVice-to-Board
Contact
Material: Copper Alloy
Insulation
Material: High Temperature
Flammability UL 94V-0
Plating
Underplating: 2.03 µm [ 80 µ"] Nickel
Wiping Area: 0.38 µm
[ 15 µ" ] or 0.76 µm [ 30 µ" ] Gold
Button
Material: Glass-Filled High
Frame
Material: Stainless Steel
Flammability UL 94V-0
Contact
Material: Copper Alloy
Insulation
Material: High Temperature
Flammability UL 94V-0
Plating
Underplating: 50 µ" [1.27 µm] Nickel
Wiping Area: 30 µ" [0.76 µm] Gold
Solder Tails: 100 µ" [ 2.54 µm ] Tin
Contact
Material: Copper Alloy
Insulation
Material: High Temperature
Flammability UL 94V-0
Plating
Underplating: 50 µ"
Wiping Area: 30 - 40 µ"
Solder Tails: 100 µ"
Thermoplastic
Temperature Thermoplastic
Thermoplastic
Thermoplastic
[ 1.27 µm ] Nickel
[ 0.76 µm ] Gold
[ 2.54 µm ] Tin
MaterialS
Current Rating: 0.5 A
Temperature Rating: -40°C to +85°C
Process Rating: 260°C (per J-STD-020C)
Current Rating:
Power Pin: 1.5 A
Signal Pin: 500 mA
Temperature Rating: -40°C to +85°C
Current Rating:
Power Pin: 1.5 A
Signal Pin: 500 mA
Temperature Rating:
Operating Temperature: 0°C to +55°C
Non-Operating Temperature: -40°C to +85°C
perForMance
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