3461-0041 3M, 3461-0041 Datasheet - Page 27

• Manufacturer Part Number: 3461-0041
• Description: CONN CARD EDGE POLAR KEY 20POS
• Manufacturer: 3M
• Series: 3000r

Specifications of 3461-0041

• Card Type: Dual Edge
• Card Thickness: 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
• Gender: Female
• Number Of Positions: 20
• Pitch: 0.100" (2.54mm)
• Number Of Rows: 2
• Mounting Type: Free Hanging (In-Line), IDC
• Features: Card Specific
• Contact Finish: Gold
• Contact Finish Thickness: 30µin (0.76µm)
• Color: Gray
• Rohs Compliant: Yes
• Product Type: Without Flanges
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 05400720133; 34610041; 5400720133; 54007201335; 80610159974

3M.com/interconnects
Assemblies, .80 mm, Input/Output
Shrunk Delta Ribbon (SDR) Cable
Attachment (SATA) Signal Cable
Attachment (SATA) Power Cable
Serial Advanced Technology
Serial Advanced Technology
Series 1MG, 1MF, 1SF
product
Series 5601
Series 5602
3M
™
caBle aSSeMBly SolutionS
• RoHS Compliant
• Supplied as a Complete Assembly
• Supports New AIA Industrial Camera
• 11 Shielded Twisted Twinax Pairs
• Double Overall Shield with Foil and
• Straight and Right Angle
• SDR-to-SDR and MDR-to-SDR
• Mates with 3M SDR and MDR
• RoHS Compliant
• 15-Position Power Cable
• Rugged Over-Molded Construction
• “Y” Type Supports Multiple Devices
• RoHS Compliant
• 7-Position Serial Signal Assembly
• Multiple Variations in Length and
• Point-to-Point Signaling
• Polarized Interface Ensures Proper
• 26 AWG Differential Pairs
• Meets SATA 2.6 Specification
Only
Link
to C/L Frame Grabber Applications
with Four Drain Wires
Outer Braid EMI Shielded Cable
Assembly
Configurations Available
Options Available
Boardmount Products
Provided in Standard Lengths
Interface Attachments
Alignment
FeatureS
®
Standard for Mini C/L Camera
Insulation
Material: Polyvinyl Chloride
Plating
Underplating: 100 µ" [ 2.55 µm ]
Wiping Area: 30 µ" [ 0.76 µm ]
Materials Vary for Connectors,
Cables, Shells and Jackscrews.
See Website for Specifics.
Insulation
Material: High Temperature
Plating
Wiping Area: 30 µ" [ 0.76 µm ]
Solder Tails: 100 µ" [ 2.54 µm ]
Underplating: 50 µ" [ 1.27 µm ]
Insulation
Material: High Temperature
Plating
Wiping Area: 30 µ" [ 0.76 µm ]
Solder Tails: 100 µ" [ 2.54 µm ]
Underplating: 50 µ" [ 1.27 µm ]
Nickel
Minimum Gold
Thermoplastic
Gold
Tin
Nickel
Thermoplastic
Gold
Tin
Nickel
MaterialS
Current Rating: 1 A
Temperature Rating: -20°C to +85°C
Current Rating: 1 A
Temperature Rating: -20°C to +85°
Current Rating: 1 A
Temperature Rating: -20°C to +85°C
perForMance
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