TR/3216TD1-R Cooper/Bussmann, TR/3216TD1-R Datasheet

TR/3216TD1-R

Manufacturer Part Number

TR/3216TD1-R

Description

FUSE 1A 63V T-LAG 1206 SMD

Manufacturer

Cooper/Bussmann

Series

CHIP™ 3216TDr

Datasheet

1.TR3216TD8-R.pdf (2 pages)

Specifications of TR/3216TD1-R

Fuse Type

Slow Blow, Time Lag

Voltage - Rated

63VAC, 63VDC

Current

Package / Case

1206 (3216 Metric)

Size / Dimension

0.126" L x 0.063" W x 0.041" H (3.20mm x 1.60mm x 1.03mm)

Mounting Type

Surface Mount

Operating Temperature

-55°C ~ 125°C

Dc Cold Resistance

0.075 Ohm

Melting I²t

0.32

Voltage Rating Vac

63V

Voltage Rating Vdc

32V

Fuse Current

Breaking Capacity

50A @ 63VAC / 35A @ 32VDC

Blow Characteristic

Time Delay

Fuse Case Style

1206

External Width

1.6mm

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Color

Lead Free Status / RoHS Status

Lead free / RoHS Compliant, Lead free / RoHS Compliant

Other names

283-2795-2
3216TD1-R
TR-3216TD1-R

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Time-Delay Chip

3216TD Series

Description

• Time-delay, surface mount fuse

• RoHS compliant, lead-free and halogen-free

• High inrush withstand capability

• Wire-in-Air performance

• Compatible with leaded and lead-free reflow and wave

Agency Information

•

Environmental Data

• Operating temperture range: -55°C to 125°C with proper

• Vibration: MIL-STD-202, Method 204 Condition D

• Solderability: ANSI/J-STD-002C, Test B

Ordering

• Specify packaging and product code

Soldering Method

• Wave immersion: 260°C, 10 Sec. max.

• Infrared reflow: 260°C, 30 Sec. max.

• Hand solder: 350°C, 3 Sec. max.

* AC Interrupting Rating (Measured at rated voltage with a unity power factor); DC Interrupting Rating (Measured at rated voltage, time constant of less than 50 microseconds, battery source)

** DC Cold Resistance (Measured at 10% of rated current)

† Typical Melting I

‡ Typical Voltage Drop (Measured at rated current after temperature stabilizes)

Device designed to carry rated current for four hours minimum. An operating current of 80% or less of rated current is recommended, with further derating required at elevated ambient temperatures.

0310

3216TD6.3-R

3216TD7-R

3216TD8-R

3216TD10-R

3216TD12-R

Product Code

solder

(i.e., TR/3216TD1-R)

Others uses 35 micron thickness copper layer.

derating

BU-SB10214

Recognition File number: E19180

t (Measured with a battery bank at rated DC voltage, 10x-rated current at 1 microsecond, not to exceed IR. Above 7A uses 70 micron thickness copper layer test board of IEC 60127-3.

Current

Rating

Amps

6.3

™

Fuses

Vac

Voltage Rating

Vdc

Page 1 of 2

Specifications

Rating (Amps)*

Interrupting

Dimensions - mm (in)

Drawing Not to Scale

Recommended Pad Layout - mm (in)

% of Amp Rating

100%

200%

300%

800%

Resistance

0.00425

Typical

0.0055

0.0045

(Ω)**

0.006

Electrical Characteristics

Data Sheet 4321

HALOGEN

FREE

0.002 Sec. Minimum, 0.05 Sec. Maximum

0.05 Sec. Minimum, 3 Sec. Maximum

1 Sec. Minimum, 120 Sec. Maximum

Melt I

Typical

10.54

12.03

16.03

42.71

45.56

4 Hours Minimum

Opening Time

t†

Drop (mV)‡

Voltage

Typical

Related parts for TR/3216TD1-R

TR/3216TD1-R Summary of contents

Page 1

... Vibration: MIL-STD-202, Method 204 Condition D • Solderability: ANSI/J-STD-002C, Test B Ordering • Specify packaging and product code (i.e., TR/3216TD1-R) Soldering Method • Wave immersion: 260°C, 10 Sec. max. • Infrared reflow: 260°C, 30 Sec. max. • Hand solder: 350°C, 3 Sec. max. ...

Page 2

... Description TR 2500 fuses on 12mm tape-and-reel on a 180mm reel per EIA-481-A & IEC286-3 The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products ...

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