39-29-1108 Molex Inc, 39-29-1108 Datasheet - Page 7

CONN HEADER 10POS 4.2MM R/A TIN

39-29-1108

Manufacturer Part Number
39-29-1108
Description
CONN HEADER 10POS 4.2MM R/A TIN
Manufacturer
Molex Inc
Series
Mini-Fit Jr™ 5569r
Type
PCB Plugr
Datasheets

Specifications of 39-29-1108

Pitch
0.165" (4.20mm)
Number Of Rows
2
Row Spacing
0.165" (4.20mm)
Contact Type
Male Pin
Connector Type
Header, Shrouded
Number Of Positions
10
Number Of Positions Loaded
All
Mounting Type
Through Hole, Right Angle
Termination
Solder
Fastening Type
Ramp
Contact Finish
Tin
Contact Finish Thickness
200µin (5.08µm)
Color
Natural
Product Type
Headers - Shrouded
Number Of Positions / Contacts
10
Mounting Style
Through Hole
Mounting Angle
Right
Termination Style
Solder
Housing Material
Nylon
Contact Material
Brass
Contact Plating
Tin
Voltage Rating
600 V
Current Rating
7 A
Agency Approvals
CSA, UL, TUV
Angle
Right
Brand/series
Mini-Fit Jr.™/5569 Series
Flammability Rating
UL94V-2
Length, Pin
3.5 mm
Material, Contact
Brass
Material, Housing
Nylon 6/6
Mounting Hole Size
2.4 mm
Number Of Contacts
10
Pin Spacing
0.165 "
Primary Type
Interconnect System, Wire to Board
Special Features
Pinstrip
Strain Relief
Low Profile
Temperature, Operating
-40 to +105 °C
Voltage, Rating
600 V
Pitch Spacing
4.2mm
Contact Termination
Through Hole Right Angle
No. Of Contacts
10
No. Of Rows
2
Connector Mounting
PCB
Gender
Header
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Contact Mating Length
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
0039291108
39-29-1108-P
WM3904
5.0 PERFORMANCE
DOCUMENT NUMBER
SHEET
5.3.2 ENVIRONMENTAL PERFORMANCE (with Phos Bronze Material and Tin plating)
REV.
REV.
C
DESIGN CONTROL
TS-5556-002
REVISE ON PC ONLY
C
1
UCR
ES-40000-3996 REV. A SHEET 7 95/MAR/10 EC U5-0926 DCBRD07.LWP
Temperature Rise
C
2
BANDURA 02-4-18
Current Cycling
UCR2002-0869
DESCRIPTION
CONDITION
C
3
REVISED
TEST
&
C
4
STATUS
C
5
TEST SUMMARY
C
6
Wire
Awg
C
7
24
24
24
24
22
22
22
22
22
24
24
24
24
TITLE:
WRITTEN BY:
C
8
SAMIEC
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
Amps
INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
1A
2A
3A
4A
1A
3A
4A
5A
1A
2A
3A
4A
2A
30 Deg C max temp rise
30 Deg C max temp rise
30 Deg C max temp rise
30 Deg C max temp rise
30 Deg C max temp rise
30 Deg C max temp rise
30 Deg C max temp rise
30 Deg C max temp rise
30 Deg C max temp rise
30 Deg C max temp rise
30 Deg C max temp rise
30 Deg C max temp rise
30 Deg C max temp rise
CHECKED BY:
BANDURA
Standard and Blind Mate Interface
REQUIREMENT
TEST SUMMARY
APPROVED
EDGLEY
Mini-Fit Jr.
(BMI)
Temp Rise
Degrees C
TS5556x2.LWP
17.6
30.2
13.4
21.4
31.8
18.2
30.2
Max
2.2
8.1
1.6
6.7
2.3
8.5
DATE:
FILENAME
99/07/09
LANGUAGE
YR/MO/DAY
English
SHEET
7

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