MLF2012A1R2K TDK Corporation, MLF2012A1R2K Datasheet

INDUCTOR MULTILAYER 1.2UH 2012

MLF2012A1R2K

Manufacturer Part Number
MLF2012A1R2K
Description
INDUCTOR MULTILAYER 1.2UH 2012
Manufacturer
TDK Corporation
Series
MLFr
Type
Ferrite Corer
Datasheet

Specifications of MLF2012A1R2K

Shielding
Shielded
Inductance
1.2µH
Tolerance
±10%
Package / Case
0805 (2012 Metric)
Current
80mA
Dc Resistance (dcr)
350 mOhm Max
Q @ Freq
45 @ 10MHz
Self Resonant Freq
150MHz
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C
Frequency - Test
10MHz
Material - Core
Ferrite
Applications
Signal Line
Core Material
Ferrite
Dimensions
1.25 mm W x 2 mm L x 0.85 mm H
Maximum Dc Current
50 mAmps
Maximum Dc Resistance
0.5 Ohms
Self Resonant Frequency
65 MHz
Q Minimum
45
Operating Temperature Range
- 25 C to + 85 C
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Saturation
-
Current - Temperature Rise
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
445-1048-2
SMD Inductors(Coils)
For Signal Line(Multilayer, Magnetic Shielded)
MLF Series MLF2012
FEATURES
• High-reliability monolithic structure.
• Ferrite core and magnetic shielding enables the design of com-
• Excellent solderability and high heat resistance permits either
• The products contain no lead and also support lead-free
• It is a product conforming to RoHS directive.
APPLICATIONS
Digital cellular phone, car audio, TV, personal computers, or vari-
ous electronic appliances.
SPECIFICATIONS
Operating temperature range
Storage temperature range
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
• Please contact our Sales office when your application are considered the following:
• All specifications are subject to change without notice.
250 to 260˚C
230˚C
180˚C
150˚C
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
pact circuits with high packing density.
flow or reflow soldering.
soldering.
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
10s max.
–40 to +85°C
–40 to +85°C
Natural
cooling
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L× W
(3) Material code
(4) Inductance value
(5) Inductance tolerance
(6) Packaging style
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
• After mounting components onto the printed circuit board, do not
• The inductance value may change due to magnetic saturation if
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
MLF 2012 A 1R0 K
(1)
The preheating temperature should be set so that the tempera-
ture difference between the solder temperature and product
temperature does not exceed 150°C.
apply stress through board bending or mishandling.
the current exceeds the rated maximum.
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
2012
47N
R15
1R0
100
K
M
T
(2)
(3) (4) (5) (6)
Product’s thickness
0.85mm
1.25mm
T
006-01 / 20090910 / e511_mlf2012.fm
Taping [reel]
47nH[0.047μH]
0.15μH
1μH
10μH
±10%
±20%
2.0× 1.25mm
Conformity to RoHS Directive
Quantity
4000 pieces/reel
2000 pieces/reel
(1/3)

Related parts for MLF2012A1R2K

MLF2012A1R2K Summary of contents

Page 1

SMD Inductors(Coils) For Signal Line(Multilayer, Magnetic Shielded) MLF Series MLF2012 FEATURES • High-reliability monolithic structure. • Ferrite core and magnetic shielding enables the design of com- pact circuits with high packing density. • Excellent solderability and high heat resistance permits ...

Page 2

SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN 2.0±0.2 0.5±0.3 Weight ( 0.85±0.2 10 1.25±0.2 14 ELECTRICAL CHARACTERISTICS Test Q Inductance Inductance frequency (µH) tolerance L, Q (MHz) min. typ. 0.047 ±20 0.068 ±20 ...

Page 3

TYPICAL ELECTRICAL CHARACTERISTICS INDUCTANCE CHANGE vs. DC SUPERPOSITION CHARACTERISTICS 100 22μH 10μH 10 1μH 1 0.1μH 0.1 0. 100 5001000 DC current ( mA ) INDUCTANCE CHANGE vs. TEMPERATURE CHARACTERISTICS 12 1μH 8 10μH 0.1μH 4 ...

Related keywords