CK21253R3M-T Taiyo Yuden, CK21253R3M-T Datasheet - Page 13

INDUCTOR 3.3UH LAYER 0805

CK21253R3M-T

Manufacturer Part Number
CK21253R3M-T
Description
INDUCTOR 3.3UH LAYER 0805
Manufacturer
Taiyo Yuden
Series
CKr
Datasheet

Specifications of CK21253R3M-T

Inductance
3.3µH
Current
130mA
Tolerance
±20%
Dc Resistance (dcr)
430 mOhm Max
Q @ Freq
20 @ 10MHz
Self Resonant Freq
41MHz
Package / Case
0805 (2012 Metric)
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C
Frequency - Test
10MHz
Applications
EMI Filter
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Shielding
-
Current - Saturation
-
Current - Temperature Rise
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CK21253R3M-T
Manufacturer:
TAIYO YUDEN
Quantity:
66 000
Part Number:
CK21253R3M-T
Manufacturer:
TAIYO/太诱
Quantity:
20 000
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
2.PCB Design
PRECAUTIONS
当社カタログをご使用の際には 「当社製品に関するお断り」 を必ずお読みください。
Stages
(Inductor layout on panelized [breakaway] PC boards)
◆Pattern configurations
1. After inductors have been mounted on the boards,
chips can be subjected to mechanical stresses in sub-
sequent manufacturing processes (PCB cutting, board
inspection, mounting of additional parts, assembly into
the chassis, wave soldering the reflow soldered boards
etc.) For this reason, planning pattern configurations
and the position of SMD inductors should be carefully
performed to minimize stress.
Precautions
1-3. When breaking PC boards along their perforations, the amount of me-
1-2. To layout the inductors for the breakaway PC board, it should be noted
1-1. The following are examples of good and bad inductor layout; SMD induc-
Mixed mount-
ing of SMD and
leaded compo-
nents
Hand-soldering
o f l e a d e d
c o m p o n e n t s
near mounted
components
Horizontal com-
ponent place-
ment
C o m p o n e n t
placement close
to the chassis
(2) Examples of good and bad solder application
Deflection of
chanical stress on the inductors can vary according to the method used.
The following methods are listed in order from least stressful to most
stressful: push-back, slit, V-grooving, and perforation. Thus, any ideal
SMD inductor layout must also consider the PCB splitting procedure.
the board
that the amount of mechanical stresses given will vary depending on in-
ductor layout. An example below should be counted for better design.
tors should be located to minimize any possible mechanical stresses from
board warp or deflection.
Item
Not recommended
Not recommended
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
Technical considerations
Recommended
Recommended
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