SDT30-127-R Coiltronics/Div of Cooper/Bussmann, SDT30-127-R Datasheet

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SDT30-127-R

Manufacturer Part Number
SDT30-127-R
Description
IND SHIELD DRUM TAPPED 2.9UH SMD
Manufacturer
Coiltronics/Div of Cooper/Bussmann
Series
SDT30r
Type
Ferrite Corer
Datasheet

Specifications of SDT30-127-R

Inductance
2.9µH
Current
600mA
Current - Saturation
850mA
Tolerance
±30%
Shielding
Shielded
Dc Resistance (dcr)
0.41 mOhm
Package / Case
0.122" L x 0.122" W x 0.039" H (3.10mm x 3.10mm x 1.00mm)
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C
Frequency - Test
100kHz
Material - Core
Ferrite
Applications
General Purpose
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Q @ Freq
-
Self Resonant Freq
-
Current - Temperature Rise
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SDT30-127-R
Manufacturer:
COOPER
Quantity:
20 000
Low-Profile, Shielded Drum Core, Tapped Inductor
SDT30 Series
Description
• Halogen Free
• Approved for use with Maxim
• 125°C maximum total temperature operation
• 3.1 x 3.1 x 1.0mm shielded drum core
• Ferrite core material
• Low losses
• High efficiency
• Reduces peak output currents
• Magnetically shielded, low EMI
• RoHS compliant
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10V rms , 0.0Adc
2 I rms : DC current for an approximate temperature rise of 40°C without core loss when either the
3 I sat : Peak current for approximately 30% rolloff at +25°C of primary or secondary with another
0409
Part
Number
SDT30-127-R
SMD Device
primary or secondary winding is running separately. Derating is necessary for AC currents. PCB
pad layout, trace thickness and width, air-flow and proximity of other heat generating components
will affect the temperature rise. It is recommended the part temperature not exceed 125°C under
worst case operating conditions verified in the end application.
winding open.
BU-SB09348
5
(2 - 3) Secondary
(1 - 2) Primary
Numbers
Pin
®
MAX14521 chip set
148 ± 20%
2.9 ± 30%
OCL
(μH)
1
Part Marking
Designator
A
Product Specifications
Primary:Secondary
Turns Raito
4 K-factor: Used to determine B p-p for core loss (see graph). B p-p = K * L * ΔI. B p-p : (Gauss), K:
5 Part Number Definition: SDT30-x2x-yy-R
1:7
Applications
• Keypads
• Instrument clusters
• EL backlighting
• Buck or boost inductor
Environmental Data
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C
• Solder reflow temperature: J-STD-020D compliant
Packaging
• Supplied in tape-and-reel packaging, 5000 parts per reel,
• Also supplied in tape-and-reel packaging, 7” diameter reel.
(K-factor from table), L: (primary inductance in μH), ΔI (peak-to-peak ripple current in amps).
• SDT30 = Product code and size
• -x2x = Turns ratio (first “x” = primary winding, “2” = “:” and second “x” = secondary winding)
• -yy = add “T7” for 7 inch tape-and-reel package. Leave blank for 5000 parts on 13 inch
• “-R” suffix = RoHS compliant
e.g., -127 = 1:7 primary to secondary turns ratio.
tape-and-reel package.
(with derated current)
13” diameter reel
See product specifications table note 5 below.
Page 1 of 4
(Amps)
I rms
0.60
0.13
2
(Amps) @25°C
Data Sheet: 4364
I sat
0.85
0.12
3
0.41 ± 15%
9.0 ± 15%
DCR (mΩ)
@20°C
HF
FREE
HALOGEN
K-factor
856.0
N/A
4

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SDT30-127-R Summary of contents

Page 1

... Numbers (μ Primary 2.9 ± 30% SDT30-127 Secondary 148 ± 20% 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10V rms , 0.0Adc 2 I rms : DC current for an approximate temperature rise of 40°C without core loss when either the primary or secondary winding is running separately. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise recommended the part temperature not exceed 125° ...

Page 2

Dimensions - iew S ide V iew 4.0 m ax. 1 rkin g 3.1 m ax. 3.1 m ax. Part Marking: Three digit marking digit indicated inductance value per Part ...

Page 3

Core Loss Inductance Characteristics 110% 100% 90% 80% 70% 60% 50% 40% 30% 20% ...

Page 4

Solder Reflow Profile T P Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C Preheat A T smax T smin t s 25°C Time 25°C to Peak Reference JDEC J-STD-020D Profile Feature Preheat and Soak ...

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