AT89C2051-24PU Atmel, AT89C2051-24PU Datasheet - Page 4

IC MCU 2K FLASH 24MHZ 20-DIP

AT89C2051-24PU

Manufacturer Part Number
AT89C2051-24PU
Description
IC MCU 2K FLASH 24MHZ 20-DIP
Manufacturer
Atmel
Series
89Cr
Datasheet

Specifications of AT89C2051-24PU

Core Processor
8051
Core Size
8-Bit
Speed
24MHz
Connectivity
UART/USART
Peripherals
LED
Number Of I /o
15
Program Memory Size
2KB (2K x 8)
Program Memory Type
FLASH
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 6 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-DIP (0.300", 7.62mm)
Processor Series
AT89x
Core
8051
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
UART
Maximum Clock Frequency
24 MHz
Number Of Programmable I/os
15
Number Of Timers
2
Operating Supply Voltage
2.7 V to 6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Minimum Operating Temperature
- 40 C
Package
20PDIP
Device Core
8051
Family Name
89C
Maximum Speed
24 MHz
Cpu Family
89C
Device Core Size
8b
Frequency (max)
24MHz
Total Internal Ram Size
128Byte
# I/os (max)
15
Number Of Timers - General Purpose
2
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (max)
6V
Operating Supply Voltage (min)
4V
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Through Hole
Pin Count
20
Package Type
PDIP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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4.7
5. Oscillator Characteristics
4
XTAL2
AT89C2051
Output from the inverting oscillator amplifier.
The XTAL1 and XTAL2 are the input and output, respectively, of an inverting amplifier which can
be configured for use as an on-chip oscillator, as shown in
ceramic resonator may be used. To drive the device from an external clock source, XTAL2
should be left unconnected while XTAL1 is driven as shown in
ments on the duty cycle of the external clock signal, since the input to the internal clocking
circuitry is through a divide-by-two flip-flop, but minimum and maximum voltage high and low
time specifications must be observed.
Figure 5-1.
Note:
Figure 5-2.
C1, C2 = 30 pF ± 10 pF for Crystals
Oscillator Connections
External Clock Drive Configuration
= 40 pF ± 10 pF for Ceramic Resonators
Figure
Figure
5-1. Either a quartz crystal or
5-2. There are no require-
0368H–MICRO–6/08

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