IC MCU OTP 512X12 18DIP

 

PIC16C54C-04I/P

Manufacturer Part NumberPIC16C54C-04I/P
DescriptionIC MCU OTP 512X12 18DIP
ManufacturerMicrochip Technology
SeriesPIC® 16C
PIC16C54C-04I/P datasheets

Availability: In stock

International delivery:

Warranty: 60 days

Shipping & payment terms

Added to cart

 

Specifications of PIC16C54C-04I/P

Program Memory TypeOTPProgram Memory Size768B (512 x 12)
Package / Case18-DIP (0.300", 7.62mm)Core ProcessorPIC
Core Size8-BitSpeed4MHz
PeripheralsPOR, WDTNumber Of I /o12
Ram Size25 x 8Voltage - Supply (vcc/vdd)3 V ~ 5.5 V
Oscillator TypeExternalOperating Temperature-40°C ~ 85°C
Processor SeriesPIC16CCorePIC
Data Bus Width8 bitData Ram Size25 B
Maximum Clock Frequency4 MHzNumber Of Programmable I/os12
Number Of Timers1Operating Supply Voltage2.5 V to 5.5 V
Maximum Operating Temperature+ 85 CMounting StyleThrough Hole
3rd Party Development Tools52715-96, 52716-328, 52717-734Development Tools By SupplierICE2000
Minimum Operating Temperature- 40 CLead Free Status / RoHS StatusLead free / RoHS Compliant
For Use With309-1059 - ADAPTER 18 ZIF BD W/18SO PLUGSDVA16XP180 - ADAPTER DEVICE FOR MPLAB-ICEAC164001 - MODULE SKT PROMATEII 18/28DIPEeprom Size-
Data Converters-Connectivity-
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
Page 171
172
Page 172
173
Page 173
174
Page 174
175
Page 175
176
Page 176
177
Page 177
178
Page 178
179
Page 179
180
Page 180
181
182
183
184
185
186
187
188
189
190
191
192
193
194
Page 177/194

Download datasheet (3Mb)Embed
PrevNext
28-Lead Plastic Dual In-line (P) – 600 mil (PDIP)
E1
n
E
eB
Dimension Limits
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
§
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-011
Drawing No. C04-079
2002 Microchip Technology Inc.
D
2
1
A
c
B1
A1
B
Units
INCHES*
MIN
NOM
MAX
n
28
p
.100
A
.160
.175
.190
A2
.140
.150
.160
A1
.015
E
.595
.600
.625
E1
.505
.545
.560
D
1.395
1.430
1.465
L
.120
.130
.135
c
.008
.012
.015
B1
.030
.050
.070
B
.014
.018
.022
eB
.620
.650
.680
5
10
15
5
10
15
Preliminary
PIC16C5X
A2
L
p
MILLIMETERS
MIN
NOM
MAX
28
2.54
4.06
4.45
4.83
3.56
3.81
4.06
0.38
15.11
15.24
15.88
12.83
13.84
14.22
35.43
36.32
37.21
3.05
3.30
3.43
0.20
0.29
0.38
0.76
1.27
1.78
0.36
0.46
0.56
15.75
16.51
17.27
5
10
15
5
10
15
DS30453D-page 175