IC MCU OTP 512X12 18DIP

 

PIC16C54C-04I/P

Manufacturer Part NumberPIC16C54C-04I/P
DescriptionIC MCU OTP 512X12 18DIP
ManufacturerMicrochip Technology
SeriesPIC® 16C
PIC16C54C-04I/P datasheets

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Specifications of PIC16C54C-04I/P

Program Memory TypeOTPProgram Memory Size768B (512 x 12)
Package / Case18-DIP (0.300", 7.62mm)Core ProcessorPIC
Core Size8-BitSpeed4MHz
PeripheralsPOR, WDTNumber Of I /o12
Ram Size25 x 8Voltage - Supply (vcc/vdd)3 V ~ 5.5 V
Oscillator TypeExternalOperating Temperature-40°C ~ 85°C
Processor SeriesPIC16CCorePIC
Data Bus Width8 bitData Ram Size25 B
Maximum Clock Frequency4 MHzNumber Of Programmable I/os12
Number Of Timers1Operating Supply Voltage2.5 V to 5.5 V
Maximum Operating Temperature+ 85 CMounting StyleThrough Hole
3rd Party Development Tools52715-96, 52716-328, 52717-734Development Tools By SupplierICE2000
Minimum Operating Temperature- 40 CLead Free Status / RoHS StatusLead free / RoHS Compliant
For Use With309-1059 - ADAPTER 18 ZIF BD W/18SO PLUGSDVA16XP180 - ADAPTER DEVICE FOR MPLAB-ICEAC164001 - MODULE SKT PROMATEII 18/28DIPEeprom Size-
Data Converters-Connectivity-
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PIC16C5X
12.3
DC Characteristics: PIC16C54/55/56/57-RCE, XTE, 10E, HSE, LPE (Extended)
PIC16C54/55/56/57-RCE, XTE, 10E, HSE, LPE
(Extended)
Param
Symbol
Characteristic/Device
No.
D001
V
Supply Voltage
DD
PIC16C5X-RCE
PIC16C5X-XTE
PIC16C5X-10E
PIC16C5X-HSE
PIC16C5X-LPE
D002
V
RAM Data Retention Voltage
DR
D003
V
V
Start Voltage to ensure
POR
DD
Power-on Reset
D004
S
V
Rise Rate to ensure
VDD
DD
Power-on Reset
(2)
D010
I
Supply Current
DD
(3)
PIC16C5X-RCE
PIC16C5X-XTE
PIC16C5X-10E
PIC16C5X-HSE
PIC16C5X-HSE
PIC16C5X-LPE
D020
I
Power-down Current
PD
* These parameters are characterized but not tested.
† Data in “Typ” column is based on characterization results at 25 C. This data is for design guidance only and is
not tested.
Note 1: This is the limit to which V
DD
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on
the current consumption.
a) The test conditions for all I
wave, from rail-to-rail; all I/O pins tristated, pulled to V
enabled/disabled as specified.
b) For standby current measurements, the conditions are the same, except that the device is in SLEEP
mode. The power-down current in SLEEP mode does not depend on the oscillator type.
3: Does not include current through R
I
= V
/2R
(mA) with R
R
DD
EXT
DS30453D-page 70
Standard Operating Conditions (unless otherwise specified)
Operating Temperature –40°C
Min
Typ†
Max
3.25
6.0
3.25
6.0
4.5
5.5
4.5
5.5
2.5
6.0
(1)
1.5*
V
SS
0.05*
1.8
3.3
1.8
3.3
4.8
10
4.8
10
9.0
20
19
55
(2)
5.0
22
0.8
18
can be lowered in SLEEP mode without losing RAM data.
measurements in active Operation mode are: OSC1 = external square
DD
, T0CKI = V
SS
. The current through the resistor can be estimated by the formula:
EXT
in k .
EXT
Preliminary
T
+125°C for extended
A
Units
Conditions
V
V
V
V
V
V
Device in SLEEP mode
V
See Section 5.1 for details on
Power-on Reset
V/ms
See Section 5.1 for details on
Power-on Reset
mA
F
= 4 MHz, V
= 5.5V
OSC
DD
mA
F
= 4 MHz, V
= 5.5V
OSC
DD
mA
F
= 10 MHz, V
= 5.5V
OSC
DD
mA
F
= 10 MHz, V
= 5.5V
OSC
DD
mA
F
= 16 MHz, V
= 5.5V
OSC
DD
A
F
= 32 kHz, V
= 3.25V,
OSC
DD
WDT disabled
A
V
= 3.25V, WDT enabled
DD
A
V
= 3.25V, WDT disabled
DD
, MCLR = V
; WDT
DD
DD
2002 Microchip Technology Inc.