DSPIC30F3012-30I/SO Microchip Technology, DSPIC30F3012-30I/SO Datasheet - Page 117

IC DSPIC MCU/DSP 24K 18SOIC

DSPIC30F3012-30I/SO

Manufacturer Part Number
DSPIC30F3012-30I/SO
Description
IC DSPIC MCU/DSP 24K 18SOIC
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F3012-30I/SO

Program Memory Type
FLASH
Program Memory Size
24KB (8K x 24)
Package / Case
18-SOIC (7.5mm Width)
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
12
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
12
Data Ram Size
2 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
Minimum Operating Temperature
- 40 C
Package
18SOIC W
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
30 MHz
Operating Supply Voltage
3.3|5 V
Interface Type
I2C/SPI/UART
On-chip Adc
8-chx12-bit
Number Of Timers
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT18SO-1 - SOCKET TRANSITION 18SOIC 300MILAC30F005 - MODULE SCKT DSPIC30F 18DIP/SOICDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F301230ISO

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F3012-30I/SO
Manufacturer:
Microchip Technology
Quantity:
1 798
Part Number:
DSPIC30F3012-30I/SO
Manufacturer:
MICRCOHI
Quantity:
20 000
The configuration procedures in the next section pro-
vide the required setup values for the conversion
speeds above 100 ksps.
16.7.1
The following configuration items are required to
achieve a 200 ksps conversion rate.
• Comply with conditions provided in
• Connect external V
• Set SSRC<2.0> = 111 in the ADCON1 register to
• Enable automatic sampling by setting the ASAM
• Write the SMPI<3.0> control bits in the ADCON2
• Configure the ADC clock period to be:
• Configure the sampling time to be 1 T
FIGURE 16-3:
© 2010 Microchip Technology Inc.
the recommended circuit shown in Figure 16-2.
enable the auto convert option.
control bit in the ADCON1 register.
register for the desired number of conversions
between interrupts.
by writing to the ADCS<5:0> control bits in the
ADCON3 register.
writing: SAMC<4:0> = 00001.
(14 + 1) x 200,000
200 KSPS CONFIGURATION
GUIDELINE
Note: C
1
Legend: C
VA
PIN
REF
Rs
12-BIT A/D CONVERTER ANALOG INPUT MODEL
value depends on device package and is not tested. Effect of C
+ and V
V
I leakage
R
R
C
ANx
T
PIN
IC
SS
HOLD
C
= 334 ns
PIN
REF
= input capacitance
= threshold voltage
= leakage current at the pin due to
= interconnect resistance
= sampling switch resistance
= sample/hold capacitance (from DAC)
various junctions
- pins following
Table
dsPIC30F2011/2012/3012/3013
AD
V
by
16-1.
DD
V
V
T
T
= 0.6V
= 0.6V
R
I leakage
± 500 nA
IC
≤ 250Ω
The following figure shows the timing diagram of the
ADC running at 200 ksps. The T
conjunction with the guidelines described above allows
a conversion speed of 200 ksps. See
code example.
16.8
The analog input model of the 12-bit ADC is shown in
Figure
function of the internal amplifier settling time and the
holding capacitor charge time.
For the ADC to meet its specified accuracy, the charge
holding capacitor (C
charge to the voltage level on the analog input pin. The
source
impedance (R
(R
required to charge the capacitor C
impedance of the analog sources must therefore be
small enough to fully charge the holding capacitor
within the chosen sample time. To minimize the effects
of pin leakage currents on the accuracy of the ADC, the
maximum recommended source impedance, R
is 2.5 kΩ. After the analog input channel is selected
(changed), this sampling function must be completed
prior to starting the conversion. The internal holding
capacitor will be in a discharged state prior to each
sample operation.
SS
) impedance combine to directly affect the time
16-3. The total sampling time for the A/D is a
Sampling
Switch
A/D Acquisition Requirements
impedance
R
SS
IC
PIN
) and the internal sampling switch
R
negligible if Rs ≤ 2.5 kΩ.
SS
V
SS
HOLD
C
= DAC capacitance
= 18 pF
≤ 3 kΩ
HOLD
(R
) must be allowed to fully
S
),
HOLD
the
DS70139G-page 117
Example 16-1
AD
. The combined
selection in
interconnect
for
S
,

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