DSPIC30F3012-30I/SO Microchip Technology, DSPIC30F3012-30I/SO Datasheet - Page 150

IC DSPIC MCU/DSP 24K 18SOIC

DSPIC30F3012-30I/SO

Manufacturer Part Number
DSPIC30F3012-30I/SO
Description
IC DSPIC MCU/DSP 24K 18SOIC
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F3012-30I/SO

Program Memory Type
FLASH
Program Memory Size
24KB (8K x 24)
Package / Case
18-SOIC (7.5mm Width)
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
12
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
12
Data Ram Size
2 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
Minimum Operating Temperature
- 40 C
Package
18SOIC W
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
30 MHz
Operating Supply Voltage
3.3|5 V
Interface Type
I2C/SPI/UART
On-chip Adc
8-chx12-bit
Number Of Timers
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT18SO-1 - SOCKET TRANSITION 18SOIC 300MILAC30F005 - MODULE SCKT DSPIC30F 18DIP/SOICDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F301230ISO

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F3012-30I/SO
Manufacturer:
Microchip Technology
Quantity:
1 798
Part Number:
DSPIC30F3012-30I/SO
Manufacturer:
MICRCOHI
Quantity:
20 000
dsPIC30F2011/2012/3012/3013
20.1
TABLE 20-1:
TABLE 20-2:
TABLE 20-3:
DS70139G-page 150
dsPIC30F201x-30I
dsPIC30F301x-30I
dsPIC30F201x-20E
dsPIC30F301x-20E
Power Dissipation:
Internal chip power dissipation:
I/O Pin power dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 18-pin PDIP (P)
Package Thermal Resistance, 18-pin SOIC (SO)
Package Thermal Resistance, 28-pin SPDIP (SP)
Package Thermal Resistance, 28-pin (SOIC)
Package Thermal Resistance, 44-pin QFN
Note 1:
V
DD
4.5-5.5V
4.5-5.5V
3.0-3.6V
3.0-3.6V
2.5-3.0V
Operating Junction Temperature Range
DC Characteristics
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
P
P
INT
Junction to ambient thermal resistance, Theta-ja (θ
I
Range
/
O
=
=
V
(
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
{
DD
V
DD
×
(
I
DD
V
Characteristic
OH
} I
Rating
×
I
OH
-40°C to 125°C
-40°C to 125°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
OH
Temp Range
)
)
+
(
V
OL
×
I
OL
)
dsPIC30FXXX-30I
JA
) numbers are achieved by package simulations.
Symbol
Symbol
30
20
10
P
DMAX
θ
θ
θ
θ
θ
P
T
T
T
T
JA
JA
JA
JA
JA
A
A
D
J
J
Min
Typ
Max MIPS
-40
-40
-40
-40
44
57
42
49
28
(T
© 2010 Microchip Technology Inc.
P
J
INT
- T
Max
Typ
dsPIC30FXXX-20E
+ P
A
) / θ
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+150
+125
20
15
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1

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