DSPIC30F3012-30I/SO Microchip Technology, DSPIC30F3012-30I/SO Datasheet - Page 172

IC DSPIC MCU/DSP 24K 18SOIC

DSPIC30F3012-30I/SO

Manufacturer Part Number
DSPIC30F3012-30I/SO
Description
IC DSPIC MCU/DSP 24K 18SOIC
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F3012-30I/SO

Program Memory Type
FLASH
Program Memory Size
24KB (8K x 24)
Package / Case
18-SOIC (7.5mm Width)
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
12
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
12
Data Ram Size
2 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
Minimum Operating Temperature
- 40 C
Package
18SOIC W
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
30 MHz
Operating Supply Voltage
3.3|5 V
Interface Type
I2C/SPI/UART
On-chip Adc
8-chx12-bit
Number Of Timers
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT18SO-1 - SOCKET TRANSITION 18SOIC 300MILAC30F005 - MODULE SCKT DSPIC30F 18DIP/SOICDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F301230ISO

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F3012-30I/SO
Manufacturer:
Microchip Technology
Quantity:
1 798
Part Number:
DSPIC30F3012-30I/SO
Manufacturer:
MICRCOHI
Quantity:
20 000
dsPIC30F2011/2012/3012/3013
FIGURE 20-12:
TABLE 20-29: SPI MASTER MODE (CKE = 0) TIMING REQUIREMENTS
DS70139G-page 172
AC CHARACTERISTICS
SP10
SP11
SP20
SP21
SP30
SP31
SP35
SP40
SP41
Note 1:
Param
No.
Note: Refer to
(CKP = 0)
(CKP = 1)
SDIx
SCKx
SDOx
SCKx
2:
3:
4:
TscL
TscH
TscF
TscR
TdoF
TdoR
TscH2doV,
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
Symbol
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
Assumes 50 pF load on all SPI pins.
Figure 20-3
SPI MODULE MASTER MODE (CKE = 0) TIMING CHARACTERISTICS
SCK
SCK
SCK
SCK
SDO
SDO
SDO
SCK
Setup Time of SDI
to SCK
Hold Time of SDI
to SCK
X
X
X
X
X
X
X
X
Output Low Time
Output High Time
Output Fall Time
Output Rise Time
Edge
Data Output Rise Time
Data Output Fall Time
Data Output Valid after
Characteristic
X
X
SP35
SP31
SP11
for load conditions.
Edge
Edge
SP40 SP41
MSb IN
MSb
X
SP10
X
Data Input
Data Input
(1)
(4
(3)
(4)
(3)
(4)
(4)
BIT 14 - - - -1
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
BIT 14 - - - - - -1
T
T
Min
CY
CY
20
20
/2
/2
SP21
SP20
Typ
SP30
(2)
SP20
SP21
LSb IN
LSb
Max
30
-40°C ≤ T
-40°C ≤ T
© 2010 Microchip Technology Inc.
Units
A
A
ns
ns
ns
ns
ns
ns
ns
ns
ns
≤ +85°C for Industrial
≤ +125°C for Extended
See parameter
DO32
See parameter
DO31
See parameter
DO32
See parameter
DO31
Conditions

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