DSPIC30F3012-30I/P Microchip Technology, DSPIC30F3012-30I/P Datasheet - Page 176

IC DSPIC MCU/DSP 24K 18DIP

DSPIC30F3012-30I/P

Manufacturer Part Number
DSPIC30F3012-30I/P
Description
IC DSPIC MCU/DSP 24K 18DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F3012-30I/P

Program Memory Type
FLASH
Program Memory Size
24KB (8K x 24)
Package / Case
18-DIP (0.300", 7.62mm)
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
12
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
12
Data Ram Size
2 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC30F005 - MODULE SCKT DSPIC30F 18DIP/SOICDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLEACICE0202 - ADAPTER MPLABICE 18P 300 MIL
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F3012-30IP

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dsPIC30F2011/2012/3012/3013
TABLE 20-32: SPI MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS
DS70139G-page 176
AC CHARACTERISTICS
SP70
SP71
SP72
SP73
SP30
SP31
SP35
SP40
SP41
SP50
SP51
SP52
SP60
Note 1:
Param
No.
2:
3:
4:
TscH2doV,
TssH2doZ
TscL
TscH
TscF
TscR
TdoF
TdoR
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
TssL2scH,
TssL2scL
TscH2ssH
TscL2ssH
TssL2doV
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
Assumes 50 pF load on all SPI pins.
Symbol
SCK
SCK
SCK
SCK
SDO
SDO
SDO
SCK
Setup Time of SDI
to SCK
Hold Time of SDI
to SCK
SS
SS↑ to SDO
high impedance
SDO
SCK
SS
X
X
↓ to SCK
X
X
X
X
X
X
X
X
X
↑ after SCK
X
Input Low Time
Input High Time
Input Fall Time
Input Rise Time
Edge
Edge
Data Output Fall Time
Data Output Rise Time
Data Output Valid after
Data Output Valid after
Characteristic
X
X
Edge
Edge
X
X
↓ or SCK
Output
(4)
X
X
X
Data Input
Edge
Data Input
(3)
(1)
(3)
X
↑ input
(3)
(3)
1.5 T
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
Min
120
30
30
20
20
10
CY
+ 40
Typ
10
10
(2)
-40°C ≤ T
-40°C ≤ T
Max
25
25
30
50
50
© 2010 Microchip Technology Inc.
A
A
≤ +85°C for Industrial
≤ +125°C for Extended
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
See parameter
DO32
See parameter
DO31
Conditions

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