DSPIC30F3012-30I/P Microchip Technology, DSPIC30F3012-30I/P Datasheet - Page 5

• Manufacturer Part Number: DSPIC30F3012-30I/P
• Description: IC DSPIC MCU/DSP 24K 18DIP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F3012-30I/P

• Program Memory Type: FLASH
• Program Memory Size: 24KB (8K x 24)
• Package / Case: 18-DIP (0.300", 7.62mm)
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 12
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 30 MHz
• Number Of Programmable I/os: 12
• Data Ram Size: 2 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC30F005 - MODULE SCKT DSPIC30F 18DIP/SOICDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLEACICE0202 - ADAPTER MPLABICE 18P 300 MIL
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: DSPIC30F3012-30IP

Pin Diagrams
© 2010 Microchip Technology Inc.
Note 1:
28-Pin QFN-S
The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to V
AN2/SS1/LVDIN/CN4/RB2
OSC2/CLKO/RC15
(1)
AN3/CN5/RB3
OSC1/CLKI
V
NC
NC
SS
dsPIC30F2011/2012/3012/3013
1
2
3
4
5
6
7
dsPIC30F2011
21
20
19
18
17
16
15
NC
NC
NC
NC
V
V
PGC/EMUC/AN5/U1RX/SDI1/SDA/CN7/RB5
DD
SS
DS70139G-page 5
SS
externally.