DSPIC30F1010-30I/SO Microchip Technology, DSPIC30F1010-30I/SO Datasheet - Page 234

• Manufacturer Part Number: DSPIC30F1010-30I/SO
• Description: IC DSPIC MCU/DSP 6K 28SOIC
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F1010-30I/SO

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 21
• Program Memory Size: 6KB (2K x 24)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240002, DM300023, DM330011
• Package: 28SOIC W
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 30 MHz
• Operating Supply Voltage: 3.3|5 V
• Number Of Programmable I/os: 21
• Interface Type: I2C/SPI/UART
• On-chip Adc: 6-chx10-bit
• Number Of Timers: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM300023 - KIT DEMO DSPICDEM SMPS BUCKDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

dsPIC30F1010/202X
TABLE 21-2:
TABLE 21-3:
TABLE 21-4:
DS70178C-page 232
dsPIC30F1010/202X-30I
dsPIC30F1010/202X-20E
Power Dissipation:
Internal chip power dissipation:
I/O Pin power dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 28-pin SOIC (SO)
Package Thermal Resistance, 28-pin QFN
Package Thermal Resistance, 28-pin SPDIP (SP)
Package Thermal Resistance, 44-pin QFN
Package Thermal Resistance, 44-pin TQFP
Note 1:
DC CHARACTERISTICS
Operating Voltage
DC10
DC11
DC12
DC16
DC17
Note 1:
Param
No.
2:
2:
3:
Operating Junction Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
P
V
V
V
V
S
Symbol
INT
P
Junction to ambient thermal resistance, Theta-ja (
Depending on operating conditions, air flow may be required for improved thermal performance.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
This is the limit to which V
DD
DD
DR
POR
VDD
I
/
O
=
=
∑
V
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
D D
(2)
Supply Voltage
Supply Voltage
RAM Data Retention Voltage
V
to ensure internal
Power-on Reset signal
V
to ensure internal
Power-on Reset signal
DD
DD
V
I
D D
D D
Start Voltage
Rise Rate
Characteristic
–
–
V
∑
Rating
Characteristic
O H
I
O H
I
OH
DD
can be lowered without losing RAM data.
+
∑
V
O L
Preliminary
(3)
I
O L
Standard Operating Conditions: 3.3V and 5.0V (±10%)
(unless otherwise stated)
Operating temperature
0.05
Min
3.0
3.0
—
—
JA
) numbers are achieved by package simulations.
Typ
V
1.5
—
—
SS
Symbol
Symbol
P
(1)
DMAX
P
T
T
T
T
JA
JA
JA
JA
JA
A
A
D
J
J
Max
5.5
5.5
—
—
48.3
33.7
Min
Typ
39.3
-40
-40
-40
-40
42
28
-40°C T
-40°C
Units
V/ms 0-5V in 0.1 sec
V
V
V
V
(T
© 2006 Microchip Technology Inc.
P
J
INT
Industrial temperature
Extended temperature
0-3.3V in 60 ms
- T
T
Max
Typ
A
A
A
+ P
) /
+85°C for Industrial
+125°C for Extended
I
/
O
Conditions
JA
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+150
+125
Max
Unit
+85
Notes
Unit
1, 2
1, 2
1, 2
1, 2
1, 2
°C
°C
°C
°C
W
W