DSPIC30F1010-30I/SO Microchip Technology, DSPIC30F1010-30I/SO Datasheet - Page 271

• Manufacturer Part Number: DSPIC30F1010-30I/SO
• Description: IC DSPIC MCU/DSP 6K 28SOIC
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F1010-30I/SO

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 21
• Program Memory Size: 6KB (2K x 24)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240002, DM300023, DM330011
• Package: 28SOIC W
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 30 MHz
• Operating Supply Voltage: 3.3|5 V
• Number Of Programmable I/os: 21
• Interface Type: I2C/SPI/UART
• On-chip Adc: 6-chx10-bit
• Number Of Timers: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM300023 - KIT DEMO DSPICDEM SMPS BUCKDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

28-Lead Skinny Plastic Dual In-line (SP) – 300 mil Body (PDIP)
© 2006 Microchip Technology Inc.
Note:
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
n
eB
E1
E
2
1
Dimension Limits
c
D
§
A1
A
Units
A2
eB
A1
E1
B1
A
E
D
B
n
p
L
c
MIN
1.345
Preliminary
.140
.125
.015
.300
.275
.125
.008
.040
.016
.320
5
5
B
B1
INCHES*
NOM
28
1.365
.100
.150
.130
.310
.285
.130
.012
.053
.019
.350
10
10
dsPIC30F1010/202X
MAX
1.385
.160
.135
.325
.295
.135
.015
.065
.022
.430
15
15
MIN
34.16
3.56
3.18
0.38
7.62
6.99
3.18
0.20
1.02
8.13
0.41
5
5
MILLIMETERS
p
NOM
28
34.67
2.54
3.30
7.87
7.24
3.30
0.29
1.33
0.48
8.89
3.81
10
10
A2
L
DS70178C-page 269
MAX
35.18
10.92
4.06
3.43
8.26
7.49
3.43
0.38
1.65
0.56
15
15