DSPIC33FJ16GS502-I/SO Microchip Technology, DSPIC33FJ16GS502-I/SO Datasheet - Page 334

• Manufacturer Part Number: DSPIC33FJ16GS502-I/SO
• Description: IC DSPIC MCU/DSP 16K 28-SOIC
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ16GS502-I/SO

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 21
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Core Frequency: 40MHz
• Core Supply Voltage: 3.3V
• Embedded Interface Type: I2C, SPI, UART
• No. Of I/o's: 21
• Flash Memory Size: 16KB
• Supply Voltage Range: 3V To 3.6V
• Package: 28SOIC W
• Device Core: dsPIC
• Family Name: dsPIC33
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 3.3 V
• Data Bus Width: 16 Bit
• Number Of Programmable I/os: 21
• Interface Type: I2C/SPI/UART
• On-chip Adc: 8-chx10-bit
• Number Of Timers: 3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE A-1:
DS70318D-page 332
Section 23.0 “Electrical
Characteristics”
Section Name
MAJOR SECTION UPDATES (CONTINUED)
Updated Typ values for Thermal Packaging Characteristics (Table 23-3).
Removed Typ value for DC Temperature and Voltage Specifications
parameter DC12 (Table 23-4).
Updated all Typ values and conditions for DC Characteristics: Operating
Current (I
Updated all Typ values for DC Characteristics: Idle Current (I
Table 23-6).
Updated all Typ values for DC Characteristics: Power Down Current (I
(see Table 23-7).
Updated all Typ values for DC Characteristics: Doze Current (I
Table 23-8).
Added Note 4 (reference to new table containing digital-only and analog pin
information, as well as Current Sink/Source capabilities) in the I/O Pin Input
Specifications (Table 23-9).
Updated Max value for BOR electrical characteristics parameter BO10 (see
Table 23-11).
Swapped Min and Typ values for Program Memory parameters D136 and
D137 (Table 23-12).
Updated Typ values for Internal RC Accuracy parameter F20 and added
Extended temperature range to table heading (see Table 23-19).
Removed all values for Reset, Watchdog Timer, Oscillator Start-up Timer,
and Power-up Timer parameter SY20 and updated conditions, which now
refers to Section 20.4 “Watchdog Timer (WDT)” and LPRC parameter
F21 (see Table 23-22).
Added specifications to High-Speed PWM Module Timing Requirements for
Tap Delay (Table 23-29).
Updated Min and Max values for 10-bit High-Speed A/D Module parameters
AD01 and AD11 (see Table 23-36).
Updated Max value and unit of measure for DAC AC Specification (see
Table 23-40).
DD
Preliminary
), updated last sentence in Note 2 (Table 23-5).
Update Description
© 2009 Microchip Technology Inc.
IDLE
DOZE
) (see
) (see
PD
)