DSPIC30F3011-30I/PT Microchip Technology, DSPIC30F3011-30I/PT Datasheet - Page 169

• Manufacturer Part Number: DSPIC30F3011-30I/PT
• Description: IC DSPIC MCU/DSP 24K 44TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F3011-30I/PT

• Program Memory Type: FLASH
• Program Memory Size: 24KB (8K x 24)
• Package / Case: 44-TQFP, 44-VQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 30
• Eeprom Size: 1K x 8
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 9x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 30 MHz
• Data Ram Size: 1024 B
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM330011, DM300018
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC30F006 - MODULE SKT FOR DSPIC30F 44TQFPAC164305 - MODULE SKT FOR PM3 44TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: DSPIC30F301130IPT

23.0
This section provides an overview of dsPIC30F electrical characteristics. Additional information will be provided in future
revisions of this document as it becomes available.
For detailed information about the dsPIC30F architecture and core, refer to the “dsPIC30F Family Reference Manual”
(DS70046).
Absolute maximum ratings for the dsPIC30F family are listed below. Exposure to these maximum rating conditions for
extended periods may affect device reliability. Functional operation of the device at these or any other conditions above
the parameters indicated in the operation listings of this specification is not implied.
Absolute Maximum Ratings
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to V
Voltage on V
Voltage on MCLR with respect to V
Maximum current out of V
Maximum current into V
Input clamp current, I
Output clamp current, I
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports (Note 2)....................................................................................................200 mA
© 2010 Microchip Technology Inc.
†
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
Note 1: Voltage spikes below Vss at the MCLR/V
2: Maximum allowable current is a function of device maximum power dissipation. See
ELECTRICAL CHARACTERISTICS
Thus, a series resistor of 50-100Ω should be used when applying a “low” level to the MCLR/V
than pulling this pin directly to Vss.
DD
with respect to V
IK
OK
(V
DD
SS
I
(V
< 0 or V
pin (Note 2)................................................................................................................250 mA
O
pin ...........................................................................................................................300 mA
< 0 or V
SS
I
SS
SS
> V
(†)
......................................................................................................... -0.3V to +5.5V
....................................................................................................... 0V to +13.25V
O
(except V
DD
> V
) .......................................................................................................... ±20 mA
DD
) ................................................................................................... ±20 mA
DD
and MCLR) (Note 1) ..................................... -0.3V to (V
PP
pin, inducing currents greater than 80 mA, may cause latch-up.
dsPIC30F3010/3011
Table
DS70141F-page 169
23-2.
PP
DD
pin, rather
+ 0.3V)