DSPIC33FJ16GS504-I/PT Microchip Technology, DSPIC33FJ16GS504-I/PT Datasheet - Page 286

IC DSPIC MCU/DSP 16K 44-TQFP

DSPIC33FJ16GS504-I/PT

Manufacturer Part Number
DSPIC33FJ16GS504-I/PT
Description
IC DSPIC MCU/DSP 16K 44-TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr

Specifications of DSPIC33FJ16GS504-I/PT

Program Memory Type
FLASH
Program Memory Size
16KB (16K x 8)
Package / Case
44-TQFP, 44-VQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
35
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
35
Data Ram Size
2 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC33FJ16GS504-I/PT
Manufacturer:
MICROCHIP
Quantity:
12 000
Part Number:
DSPIC33FJ16GS504-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC33FJ16GS504-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
DSPIC33FJ16GS504-I/PT
Manufacturer:
MICROCHIP
Quantity:
7 004
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
24.1
TABLE 24-1:
TABLE 24-2:
TABLE 24-3:
DS70318D-page 284
Characteristic
Industrial Temperature Devices
Extended Temperature Devices
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 44-Pin QFN
Package Thermal Resistance, 44-Pin TFQP
Package Thermal Resistance, 28-Pin SPDIP
Package Thermal Resistance, 28-Pin SOIC
Package Thermal Resistance, 28-Pin QFN-S
Package Thermal Resistance, 18-Pin SOIC
Note 1:
DC Characteristics
P
I/O = Σ ({V
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
INT
Junction to ambient thermal resistance, Theta-
= V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
x (I
– V
V
DD
(in Volts)
DD
3.0-3.6V
3.0-3.6V
OH
Characteristic
– Σ I
Range
} x I
Rating
OH
OH
)
) + Σ (V
OL
x I
OL
-40°C to +125°C
)
Preliminary
-40°C to +85°C
Temp Range
(in °C)
JA
JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX
θ
θ
θ
θ
θ
θ
P
T
T
T
T
JA
JA
JA
JA
JA
JA
A
A
D
J
J
Min
Typ
-40
-40
-40
-40
dsPIC33FJ06GS101/X02 and
28
39
42
47
34
57
dsPIC33FJ16GSX02/X04
(T
P
© 2009 Microchip Technology Inc.
INT
J
– T
Max
Typ
Max MIPS
+ P
A
)/θ
40
40
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+140
+125
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1
1

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