DSPIC33FJ128GP310A-I/PT Microchip Technology, DSPIC33FJ128GP310A-I/PT Datasheet - Page 268

• Manufacturer Part Number: DSPIC33FJ128GP310A-I/PT
• Description: IC DSPIC MCU/DSP 128K 100-TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ128GP310A-I/PT

• Program Memory Type: FLASH
• Program Memory Size: 128KB (128K x 8)
• Package / Case: 100-TFQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 85
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 32x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC33F
• Core: dsPIC
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 85
• Data Ram Size: 16 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1001 - DSPIC33 BREAKOUT BOARD
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

dsPIC33FJXXXGPX06A/X08A/X10A
25.1
TABLE 25-1:
TABLE 25-2:
TABLE 25-3:
DS70593B-page 268
DC5
dsPIC33FJXXXGPX06A/X08A/X10A
Extended Temperature Devices
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 100-pin TQFP (14x14x1 mm)
Package Thermal Resistance, 100-pin TQFP (12x12x1 mm)
Package Thermal Resistance, 80-pin TQFP (12x12x1 mm)
Package Thermal Resistance, 64-pin TQFP (10x10x1 mm)
Package Thermal Resistance, 64-pin QFN (9x9x0.9 mm)
Note 1:
Characteristic
Operating Junction Temperature Range
DC Characteristics
P
I/O =  ({V
Operating Ambient Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
INT
Junction to ambient thermal resistance, Theta-
= V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
x (I
- V
V
DD
(in Volts)
DD
3.0-3.6V
3.0-3.6V
OH
Characteristic
-  I
Range
} x I
Rating
OH
OH
)
) +  (V
OL
x I
OL
)
-40°C to +125°C
Preliminary
-40°C to +85°C
Temp Range
(in °C)
JA
(

JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX





P
T
T
T
T
JA
JA
JA
JA
JA
A
A
D
J
J
dsPIC33FJXXXGPX06A/X08A/X10A
Min
Typ
-40
-40
-40
-40
40
40
40
40
28
(T
 2009 Microchip Technology Inc.
P
INT
J
- T
Max
Typ
Max MIPS
—
—
—
—
—
—
—
—
—
+ P
A
)/
40
40
I
/
JA
O
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+140
+125
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1