IC DSPIC MCU/DSP 128K 100-TQFP

DSPIC33FJ128GP310A-I/PT

Manufacturer Part NumberDSPIC33FJ128GP310A-I/PT
DescriptionIC DSPIC MCU/DSP 128K 100-TQFP
ManufacturerMicrochip Technology
SeriesdsPIC™ 33F
DSPIC33FJ128GP310A-I/PT datasheet
 

Specifications of DSPIC33FJ128GP310A-I/PT

Program Memory TypeFLASHProgram Memory Size128KB (128K x 8)
Package / Case100-TFQFPCore ProcessordsPIC
Core Size16-BitSpeed40 MIPs
ConnectivityI²C, IrDA, LIN, SPI, UART/USARTPeripheralsAC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o85Ram Size16K x 8
Voltage - Supply (vcc/vdd)3 V ~ 3.6 VData ConvertersA/D 32x10b/12b
Oscillator TypeInternalOperating Temperature-40°C ~ 85°C
ProductDSCsData Bus Width16 bit
Processor SeriesDSPIC33FCoredsPIC
Maximum Clock Frequency40 MHzNumber Of Programmable I/os85
Data Ram Size16 KBMaximum Operating Temperature+ 85 C
Mounting StyleSMD/SMT3rd Party Development Tools52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By SupplierPG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033Minimum Operating Temperature- 40 C
Lead Free Status / RoHS StatusLead free / RoHS CompliantFor Use With876-1001 - DSPIC33 BREAKOUT BOARD
Eeprom Size-  
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189
190
191
192
193
194
195
196
197
198
199
200
201
202
203
204
205
206
207
208
209
210
211
212
213
214
215
216
217
218
219
220
221
222
223
224
225
226
227
228
229
230
231
232
233
234
235
236
237
238
239
240
241
242
243
244
245
246
247
248
249
250
251
252
253
254
255
256
257
258
259
260
261
262
263
264
265
266
267
268
269
270
271
272
273
274
275
276
277
278
279
280
281
282
283
284
285
286
287
288
289
290
291
292
293
294
295
296
297
298
299
300
301
302
303
304
305
306
307
308
309
310
311
312
313
314
315
316
317
318
319
320
321
Page 321
322
Page 322
323
Page 323
324
Page 324
325
Page 325
326
Page 326
327
Page 327
328
Page 328
329
Page 329
330
Page 330
331
332
333
334
335
336
337
338
Page 321/338

Download datasheet (3Mb)Embed
PrevNext
dsPIC33FJXXXGPX06A/X08A/X10A
64-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D1
e
N
b
1 2 3
NOTE 1
c
β
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
 2009 Microchip Technology Inc.
E
E1
NOTE 2
A
φ
A1
L
L1
Units
MILLIMETERS
Dimension Limits
MIN
NOM
N
64
e
0.50 BSC
A
A2
0.95
1.00
A1
0.05
L
0.45
0.60
L1
1.00 REF
φ
3.5°
E
12.00 BSC
D
12.00 BSC
E1
10.00 BSC
D1
10.00 BSC
c
0.09
b
0.17
0.22
α
11°
12°
β
11°
12°
Microchip Technology Drawing C04-085B
Preliminary
α
A2
MAX
1.20
1.05
0.15
0.75
0.20
0.27
13°
13°
DS70593B-page 321