DSPIC33FJ128GP708-I/PT Microchip Technology, DSPIC33FJ128GP708-I/PT Datasheet - Page 260

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DSPIC33FJ128GP708-I/PT

Manufacturer Part Number
DSPIC33FJ128GP708-I/PT
Description
IC DSPIC MCU/DSP 128K 80TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr

Specifications of DSPIC33FJ128GP708-I/PT

Program Memory Type
FLASH
Program Memory Size
128KB (128K x 8)
Package / Case
80-TFQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
69
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 24x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
69
Data Ram Size
16 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1001 - DSPIC33 BREAKOUT BOARDDM300024 - KIT DEMO DSPICDEM 1.1DV164033 - KIT START EXPLORER 16 MPLAB ICD2MA330012 - MODULE DSPIC33 100P TO 84QFPMA330011 - MODULE DSPIC33 100P TO 100QFPDM300019 - BOARD DEMO DSPICDEM 80L STARTERDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164328 - MODULE SKT FOR 80TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC33FJ128GP708-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC33FJ128GP708-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
dsPIC33FJXXXGPX06/X08/X10
25.1
TABLE 25-1:
TABLE 25-2:
TABLE 25-3:
DS70286C-page 258
DC5
dsPIC33FJXXXGPX06/X08/X10
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 100-pin TQFP (14x14x1 mm)
Package Thermal Resistance, 100-pin TQFP (12x12x1 mm)
Package Thermal Resistance, 80-pin TQFP (12x12x1 mm)
Package Thermal Resistance, 64-pin TQFP (10x10x1 mm)
Note 1:
Characteristic
Operating Junction Temperature Range
DC Characteristics
P
I/O =
Operating Ambient Temperature Range
INT
Junction to ambient thermal resistance, Theta-
= V
({V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
x (I
- V
V
DD
(in Volts)
DD
3.0-3.6V
OH
Characteristic
-
Range
} x I
I
Rating
OH
OH
)
) +
(V
OL
x I
OL
)
-40°C to +85°C
Temp Range
(in °C)
JA
(
JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX
P
T
T
JA
JA
JA
JA
A
D
J
dsPIC33FJXXXGPX06/X08/X10
Min
Typ
-40
-40
40
40
40
40
(T
© 2009 Microchip Technology Inc.
P
INT
J
- T
Max
Typ
Max MIPS
+ P
A
)/
40
I
/
JA
O
°C/W
°C/W
°C/W
°C/W
+125
Max
Unit
+85
Notes
Unit
°C
°C
W
W
1
1
1
1

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