DSPIC33FJ128GP708A-I/PT Microchip Technology, DSPIC33FJ128GP708A-I/PT Datasheet - Page 25

• Manufacturer Part Number: DSPIC33FJ128GP708A-I/PT
• Description: IC DSPIC MCU/DSP 128K 80-TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ128GP708A-I/PT

• Program Memory Type: FLASH
• Program Memory Size: 128KB (128K x 8)
• Package / Case: 80-TFQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 69
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 24x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC33F
• Core: dsPIC
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 69
• Data Ram Size: 16 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
• Minimum Operating Temperature: - 40 C
• Package: 80TQFP
• Device Core: dsPIC
• Family Name: dsPIC33
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 3.3 V
• Interface Type: CAN/I2C/SPI/UART
• On-chip Adc: 48-chx10-bit|48-chx12-bit
• Number Of Timers: 9
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1001 - DSPIC33 BREAKOUT BOARD
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

2.0
2.1
Getting started with the dsPIC33FJXXXGPX06A/
X08A/X10A family of 16-bit Digital Signal Controllers
(DSCs) requires attention to a minimal set of device pin
connections before proceeding with development. The
following is a list of pin names, which must always be
connected:
• All V
• All AV
• V
• MCLR pin
• PGECx/PGEDx pins used for In-Circuit Serial
• OSC1 and OSC2 pins when external oscillator
Additionally, the following pins may be required:
• V
 2009 Microchip Technology Inc.
(see Section 2.2 “Decoupling Capacitors”)
is not used)
(see Section 2.2 “Decoupling Capacitors”)
(see Section 2.3 “Capacitor on Internal Voltage
Regulator (V
(see Section 2.4 “Master Clear (MCLR) Pin”)
Programming™ (ICSP™) and debugging purposes
(see Section 2.5 “ICSP Pins”)
source is used
(see Section 2.6 “External Oscillator Pins”)
reference for ADC module is implemented
Note:
Note 1: This data sheet summarizes the features
REF
CAP
DD
+/V
/V
DD
2: Some registers and associated bits
GUIDELINES FOR GETTING
STARTED WITH 16-BIT
DIGITAL SIGNAL
CONTROLLERS
Basic Connection Requirements
DDCORE
and V
REF
and AV
The AV
connected independent of the ADC
voltage reference source.
of
X10A family of devices. It is not intended
to be a comprehensive reference source.
To complement the information in this
data sheet, refer to the “dsPIC33F/
PIC24H
Please see the Microchip web site
(www.microchip.com)
dsPIC33F/PIC24H
Manual sections.
described in this section may not be avail-
able on all devices. Refer to Section 4.0
“Memory Organization” in this data
sheet for device-specific register and bit
information.
- pins used when external voltage
CAP
SS
the dsPIC33FJXXXGPX06A/X08A/
SS
pins
/V
DD
DDCORE
pins (regardless if ADC module
Family
and AV
dsPIC33FJXXXGPX06A/X08A/X10A
)”)
Reference
SS
Family
for
pins must be
the
Reference
Manual”.
latest
Preliminary
2.2
The use of decoupling capacitors on every pair of
power supply pins, such as V
AV
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation
• Placement on the printed circuit board: The
• Handling high frequency noise: If the board is
• Maximizing performance: On the board layout
of 0.1 µF (100 nF), 10-20V. This capacitor should
be a low-ESR and have resonance frequency in
the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
one-quarter inch (6 mm) in length.
experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum thereby reducing PCB track inductance.
SS
is required.
Decoupling Capacitors
DD
, V
DS70593B-page 25
SS
, AV
DD
and