DSPIC33FJ128GP708A-I/PT Microchip Technology, DSPIC33FJ128GP708A-I/PT Datasheet - Page 321

• Manufacturer Part Number: DSPIC33FJ128GP708A-I/PT
• Description: IC DSPIC MCU/DSP 128K 80-TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ128GP708A-I/PT

• Program Memory Type: FLASH
• Program Memory Size: 128KB (128K x 8)
• Package / Case: 80-TFQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 69
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 24x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC33F
• Core: dsPIC
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 69
• Data Ram Size: 16 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
• Minimum Operating Temperature: - 40 C
• Package: 80TQFP
• Device Core: dsPIC
• Family Name: dsPIC33
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 3.3 V
• Interface Type: CAN/I2C/SPI/UART
• On-chip Adc: 48-chx10-bit|48-chx12-bit
• Number Of Timers: 9
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1001 - DSPIC33 BREAKOUT BOARD
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

 2009 Microchip Technology Inc.
64-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
e
b
c
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
β
N
dsPIC33FJXXXGPX06A/X08A/X10A
1 2 3
D
D1
L
Dimension Limits
Preliminary
E1
NOTE 2
φ
Units
D1
A2
A1
L1
E1
N
A
E
D
e
L
φ
c
b
α
β
E
A1
A
0.95
0.05
0.45
0.09
0.17
MIN
11°
11°
0°
–
MILLIMETERS
12.00 BSC
12.00 BSC
10.00 BSC
10.00 BSC
0.50 BSC
1.00 REF
L1
NOM
1.00
0.60
0.22
3.5°
12°
12°
64
–
–
–
Microchip Technology Drawing C04-085B
MAX
1.20
1.05
0.15
0.75
0.20
0.27
13°
13°
7°
DS70593B-page 321
α
A2