DSPIC30F6012A-30I/PT Microchip Technology, DSPIC30F6012A-30I/PT Datasheet - Page 58

• Manufacturer Part Number: DSPIC30F6012A-30I/PT
• Description: IC DSPIC MCU/DSP 144K 64TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F6012A-30I/PT

• Program Memory Type: FLASH
• Program Memory Size: 144KB (48K x 24)
• Package / Case: 64-TFQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
• Number Of I /o: 52
• Eeprom Size: 4K x 8
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 30 MHz
• Number Of Programmable I/os: 52
• Data Ram Size: 8 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM330011
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT64PT5 - SOCKET TRAN ICE 64MQFP/TQFPAC164319 - MODULE SKT MPLAB PM3 64TQFPAC30F008 - MODULE SKT FOR DSPIC30F 64TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: DSPIC30F6012A30IP

13.0
TABLE 13-1:
DS70102K-page 58
AC/DC CHARACTERISTICS
D110
D112
D113
D001
D002
D031
D041
D080
D090
D012
P1
P1a
P1b
P2
P3
P4
P4a
P5
P6
P7
P8
P9a
Param.
No.
AC/DC CHARACTERISTICS AND TIMING REQUIREMENTS
V
I
I
V
V
V
V
V
V
C
T
T
T
T
T
T
T
T
T
T
T
T
PP
DDP
SCLK
SCLK
SCLK
SET
SET
IL
IH
OL
OH
HLD
DLY
DLY
DLY
HLD
DLY
DLY
IHH
DD
DDBULK
IO
Sym
1
2
1
1a
2
3
4
1
2
L
H
AC/DC CHARACTERISTICS
High Programming Voltage on MCLR/V
Programming Current on MCLR/V
Supply Current during programming
Supply voltage
Supply voltage for Bulk Erase
programming
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
Capacitive Loading on I/O Pin (PGD)
Serial Clock (PGC) period
Serial Clock (PGC) low time
Serial Clock (PGC) high time
Input Data Setup Timer to PGC ↓
Input Data Hold Time from PGC ↓
Delay between 4-bit command and
command operand
Delay between 4-bit command operand
and next 4-bit command
Delay between last PGC ↓ of command to
first PGC ↑ of VISI output
V
Input data hold time from MCLR/V
Delay between last PGC ↓ of command
word to PGD driven ↑ by programming
executive
Programming Executive Command
processing time
DD
↑ setup time to MCLR/V
Characteristic
PP
PP
PP
↑
PP
Standard Operating Conditions
(unless otherwise stated)
Operating Temperature: 25° C is recommended
V
0.8 V
DD
9.00
Min
V
400
400
100
2.5
4.5
50
20
20
15
15
20
20
20
20
10
—
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1
2
5
SS
- 0.7
DD
0.2 V
13.25
Max
V
300
5.5
5.5
0.6
30
30
30
50
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DD
SS
© 2010 Microchip Technology Inc.
Units
mA
mA
mA
ms
μA
pF
ns
ns
ns
μs
ns
ns
ns
ns
ns
ns
ns
ns
μs
μs
μs
V
V
V
V
V
V
V
Row Erase
Program
memory
Row Erase
Data EEPROM
Bulk Erase
I
I
To meet AC
specifications
ICSP™ mode
Enhanced
ICSP mode
ICSP mode
Enhanced
ICSP mode
ICSP mode
Enhanced
ICSP mode
ICSP mode
Enhanced
ICSP mode
OL
OH
Conditions
= 8.5 mA
= -3.0 mA
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