P89LPC932A1FDH,512 NXP Semiconductors, P89LPC932A1FDH,512 Datasheet - Page 58

• Manufacturer Part Number: P89LPC932A1FDH,512
• Description: IC 80C51 MCU FLASH 8K 28-TSSOP
• Manufacturer: NXP Semiconductors
• Series: LPC900r

Specifications of P89LPC932A1FDH,512

• Program Memory Type: FLASH
• Program Memory Size: 8KB (8K x 8)
• Package / Case: 28-TSSOP
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 18MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
• Number Of I /o: 26
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 2.4 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: P89LPC9x
• Core: 80C51
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: I2C/SPI/UART
• Maximum Clock Frequency: 18 MHz
• Number Of Programmable I/os: 26
• Number Of Timers: 2
• Operating Supply Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Minimum Operating Temperature: - 40 C
• Cpu Family: 89LP
• Device Core: 80C51
• Device Core Size: 8b
• Frequency (max): 18MHz
• Total Internal Ram Size: 768Byte
• # I/os (max): 26
• Number Of Timers - General Purpose: 2
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 2.4V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 28
• Package Type: TSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: OM6292 - DEMO BOARD PCA2125 RTCDB-TSSOP-LPC932 - BOARD FOR LPC932 TSSOP622-1014 - BOARD FOR LPC9XX TSSOP622-1008 - BOARD FOR LPC9103 10-HVSON622-1006 - SOCKET ADAPTER BOARDMCB900K - BOARD PROTOTYPE NXP 89LPC9EPM900K - EMULATOR/PROGRAMMER NXP P89LPC9568-4000 - DEMO BOARD SPI/I2C TO DUAL UART568-3510 - DEMO BOARD SPI/I2C TO UART622-1003 - KIT FOR LCD DEMO622-1002 - USB IN-CIRCUIT PROG LPC9XX568-1759 - EMULATOR DEBUGGER/PROGRMMR LPC9X568-1758 - BOARD EVAL FOR LPC93X MCU FAMILY
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4515-5; 935276132512; P89LPC932A1FDH; P89LPC932A1FDH

NXP Semiconductors
Fig 31. Package outline SOT788-1 (HVQFN28)
P89LPC932A1_3
Product data sheet
HVQFN28: plastic thermal enhanced very thin quad flat package; no leads;
28 terminals; body 6 x 6 x 0.85 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT788-1
max.
A
1
(1)
terminal 1
index area
terminal 1
index area
L
0.05
0.00
A 1
E h
1
0.35
0.25
7
b
28
0.2
IEC
- - -
c
8
e
D
6.1
5.9
(1)
4.25
3.95
D h
e 1
D h
D
MO-220
JEDEC
E
6.1
5.9
(1)
0
REFERENCES
4.25
3.95
b
E h
Rev. 03 — 12 March 2007
8-bit microcontroller with accelerated two-clock 80C51 core
0.65
22
14
e
JEITA
3.9
scale
e 1
- - -
15
21
2.5
B
e
3.9
w
v
e 2
A
E
e 2
M
M
C
C
0.75
0.50
L
A
5 mm
B
0.1
v
A
0.05
A 1
w
y 1 C
0.05
y
PROJECTION
EUROPEAN
P89LPC932A1
0.1
y 1
detail X
X
C
y
© NXP B.V. 2007. All rights reserved.
ISSUE DATE
02-10-22
SOT788-1
c
58 of 64