P89LPC932A1FDH,512 NXP Semiconductors, P89LPC932A1FDH,512 Datasheet - Page 59

• Manufacturer Part Number: P89LPC932A1FDH,512
• Description: IC 80C51 MCU FLASH 8K 28-TSSOP
• Manufacturer: NXP Semiconductors
• Series: LPC900r

Specifications of P89LPC932A1FDH,512

• Program Memory Type: FLASH
• Program Memory Size: 8KB (8K x 8)
• Package / Case: 28-TSSOP
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 18MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
• Number Of I /o: 26
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 2.4 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: P89LPC9x
• Core: 80C51
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: I2C/SPI/UART
• Maximum Clock Frequency: 18 MHz
• Number Of Programmable I/os: 26
• Number Of Timers: 2
• Operating Supply Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Minimum Operating Temperature: - 40 C
• Cpu Family: 89LP
• Device Core: 80C51
• Device Core Size: 8b
• Frequency (max): 18MHz
• Total Internal Ram Size: 768Byte
• # I/os (max): 26
• Number Of Timers - General Purpose: 2
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 2.4V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 28
• Package Type: TSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: OM6292 - DEMO BOARD PCA2125 RTCDB-TSSOP-LPC932 - BOARD FOR LPC932 TSSOP622-1014 - BOARD FOR LPC9XX TSSOP622-1008 - BOARD FOR LPC9103 10-HVSON622-1006 - SOCKET ADAPTER BOARDMCB900K - BOARD PROTOTYPE NXP 89LPC9EPM900K - EMULATOR/PROGRAMMER NXP P89LPC9568-4000 - DEMO BOARD SPI/I2C TO DUAL UART568-3510 - DEMO BOARD SPI/I2C TO UART622-1003 - KIT FOR LCD DEMO622-1002 - USB IN-CIRCUIT PROG LPC9XX568-1759 - EMULATOR DEBUGGER/PROGRMMR LPC9X568-1758 - BOARD EVAL FOR LPC93X MCU FAMILY
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4515-5; 935276132512; P89LPC932A1FDH; P89LPC932A1FDH

NXP Semiconductors
Fig 32. Package outline SOT117-1 (DIP28)
P89LPC932A1_3
Product data sheet
DIP28: plastic dual in-line package; 28 leads (600 mil)
DIMENSIONS (mm dimensions are derived from the original inch dimensions)
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
Note
inches
UNIT
mm
SOT117-1
OUTLINE
VERSION
L
Z
max.
28
5.1
0.2
1
A
pin 1 index
min.
0.51
0.02
A
1
051G05
IEC
max.
0.16
A
4
2
0.066
0.051
1.7
1.3
b
e
D
0.020
0.014
MO-015
0.53
0.38
JEDEC
b
1
REFERENCES
0.013
0.009
0.32
0.23
Rev. 03 — 12 March 2007
c
0
8-bit microcontroller with accelerated two-clock 80C51 core
b
1.41
1.34
D
36
35
SC-510-28
(1)
JEITA
scale
5
14.1
13.7
0.56
0.54
E
(1)
15
b
14
1
10 mm
2.54
0.1
e
A
1
w
E
M
A
15.24
2
0.6
e
1
A
0.15
0.13
3.9
3.4
L
PROJECTION
EUROPEAN
P89LPC932A1
15.80
15.24
c
0.62
0.60
M
E
17.15
15.90
0.68
0.63
M
(e )
M
M
H
H
1
E
© NXP B.V. 2007. All rights reserved.
ISSUE DATE
0.25
0.01
99-12-27
03-02-13
w
SOT117-1
max.
0.067
1.7
Z
(1)
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