LPC2102FBD48,151 NXP Semiconductors, LPC2102FBD48,151 Datasheet - Page 3

• Manufacturer Part Number: LPC2102FBD48,151
• Description: IC ARM7 MCU FLASH 16K 48-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2100r

Specifications of LPC2102FBD48,151

• Program Memory Type: FLASH
• Program Memory Size: 16KB (16K x 8)
• Package / Case: 48-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 70MHz
• Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 32
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC21
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 4 KB
• Interface Type: I2C/JTAG/SPI/SSP/UART
• Maximum Clock Frequency: 70 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Cpu Family: LPC2000
• Device Core: ARM7TDMI-S
• Device Core Size: 16/32Bit
• Frequency (max): 70MHz
• Total Internal Ram Size: 4KB
• # I/os (max): 32
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Supply Voltage (max): 1.95/3.6V
• Operating Supply Voltage (min): 1.65/3V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 48
• Package Type: LQFP
• Package: 48LQFP
• Family Name: LPC2000
• Maximum Speed: 70 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4310 - EVAL BOARD LPC2158 W/LCD568-4297 - BOARD EVAL LPC21XX MCB2100MCB2103UME - BOARD EVAL MCB2103 + ULINK-MEMCB2103U - BOARD EVAL MCB2103 + ULINK2MCB2103 - BOARD EVAL NXP LPC2101/2101/2103622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 568-2093; 935280965151; LPC2102FBD48-S

NXP Semiconductors
4. Block diagram
LPC2101_02_03_4
Product data sheet
Fig 1.
3
4
3
3
4
3
4
P0[31:0]
EINT2 to
EINT0
AD0[7:0]
P0[31:0]
MAT0
MAT1
MAT2
MAT3
CAP0
CAP1
CAP2
(1) Pins shared with GPIO.
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
Block diagram
LPC2101/2102/2103
PURPOSE I/O
HIGH SPEED
CONTROLLER
GENERAL
8 kB SRAM
INTERNAL
2 kB/4 kB/
SRAM
EXTERNAL COUNTER
ARM7 local bus
CAPTURE/COMPARE
TIMER 0/TIMER 1/
TIMER 2/TIMER 3
INTERRUPTS
PURPOSE I/O
WATCHDOG
EXTERNAL
GENERAL
BOOT ROM
TIMER
ADC
ACCELERATOR
8 kB
32 kB FLASH
8 kB/16 kB/
MEMORY
TRST
Rev. 04 — 2 June 2009
ARM7TDMI-S
TMS
AHB BRIDGE
TEST/DEBUG
INTERFACE
AHB TO APB
BRIDGE
TCK
peripheral bus)
TDI
(Advanced High-performance Bus)
APB (ARM
TDO
system
clock
AMBA AHB
Single-chip 16-bit/32-bit microcontrollers
PLL
INTERFACES 0 AND 1
SERIAL INTERFACES
SYSTEM CONTROL
REAL-TIME CLOCK
I
2
UART0/UART1
C-BUS SERIAL
SPI AND SSP
XTAL1
XTAL2 V
CONTROLLER
FUNCTIONS
LPC2101/02/03
INTERRUPT
VECTORED
SYSTEM
RST
DD(3V3)
002aab814
V
SS
V
DD(1V8)
© NXP B.V. 2009. All rights reserved.
DSR1, CTS1,
RTS1, DTR1
DCD1, RI1
SCL0, SCL1
SDA0, SDA1
SCK0, SCK1
MOSI0, MOSI1
MISO0, MISO1
SSEL0, SSEL1
TXD0, TXD1
RXD0, RXD1
RTCX1
RTCX2
VBAT
(1)
(1)
(1)
(1)
(1)
3 of 37
(1)
(1)
(1)