LPC1756FBD80,551 NXP Semiconductors, LPC1756FBD80,551 Datasheet - Page 69

• Manufacturer Part Number: LPC1756FBD80,551
• Description: IC ARM CORTEX MCU 256K 80-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC17xxr

Specifications of LPC1756FBD80,551

• Program Memory Type: FLASH
• Program Memory Size: 256KB (256K x 8)
• Package / Case: 80-LQFP
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 52
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 6x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC17
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Interface Type: CAN, I2C, SPI, UART
• Maximum Clock Frequency: 100 MHz
• Number Of Programmable I/os: 52
• Number Of Timers: 3
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 6 Channel
• On-chip Dac: 10 bit
• Package: 80LQFP
• Device Core: ARM Cortex M3
• Family Name: LPC17xx
• Maximum Speed: 100 MHz
• Cpu Family: LPC17xx
• Device Core Size: 32b
• Frequency (max): 100MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 52
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 2.4/2.7V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 80
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4791; 935288606551

NXP Semiconductors
16. Abbreviations
LPC1759_58_56_54_52_51
Product data sheet
Table 23.
Acronym
ADC
AHB
AMBA
APB
BOD
CAN
DAC
DMA
EOP
GPIO
IRC
IrDA
JTAG
MAC
MIIM
OTG
PHY
PLL
PWM
RMII
SE0
SPI
SSI
SSP
TTL
UART
USB
Abbreviations
All information provided in this document is subject to legal disclaimers.
Advanced Microcontroller Bus Architecture
BrownOut Detection
Controller Area Network
Digital-to-Analog Converter
Internal RC
Media Access Control
Media Independent Interface Management
On-The-Go
Reduced Media Independent Interface
Description
Analog-to-Digital Converter
Advanced High-performance Bus
Advanced Peripheral Bus
Direct Memory Access
End Of Packet
General Purpose Input/Output
Infrared Data Association
Joint Test Action Group
Physical Layer
Phase-Locked Loop
Pulse Width Modulator
Single Ended Zero
Serial Peripheral Interface
Serial Synchronous Interface
Synchronous Serial Port
Transistor-Transistor Logic
Universal Asynchronous Receiver/Transmitter
Universal Serial Bus
Rev. 6.01 — 11 March 2011
LPC1759/58/56/54/52/51
32-bit ARM Cortex-M3 microcontroller
© NXP B.V. 2011. All rights reserved.
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