LPC1766FBD100,551 NXP Semiconductors, LPC1766FBD100,551 Datasheet - Page 17

IC ARM CORTEX MCU 256K 100-LQFP

LPC1766FBD100,551

Manufacturer Part Number
LPC1766FBD100,551
Description
IC ARM CORTEX MCU 256K 100-LQFP
Manufacturer
NXP Semiconductors
Series
LPC17xxr
Datasheets

Specifications of LPC1766FBD100,551

Program Memory Type
FLASH
Program Memory Size
256KB (256K x 8)
Package / Case
100-LQFP
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
100MHz
Connectivity
CAN, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
70
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 3.6 V
Data Converters
A/D 8x12b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC17
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
CAN, I2C, SPI, UART
Maximum Clock Frequency
100 MHz
Number Of Programmable I/os
70
Number Of Timers
3
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB1760, MCB1760U, MCB1760UME
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 8 Channel
On-chip Dac
10 bit
Cpu Family
LPC17xx
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
100MHz
Total Internal Ram Size
64KB
# I/os (max)
70
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2.4V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
100
Package Type
LQFP
Package
100LQFP
Family Name
LPC1700
Maximum Speed
100 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4795
935287917551

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC1766FBD100,551
Manufacturer:
NXP
Quantity:
5 600
Part Number:
LPC1766FBD100,551
Quantity:
9 999
Part Number:
LPC1766FBD100,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Part Number:
LPC1766FBD100,551
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
[4]
[5]
[6]
[7]
[8]
[9]
[10] Pad provides special analog functionality.
[11] When the system oscillator is not used, connect XTAL1 and XTAL2 as follows: XTAL1 can be left floating or can be grounded (grounding
[12] When the RTC is not used, connect VBAT to V
LPC1769_68_67_66_65_64_63
Product data sheet
Open-drain 5 V tolerant digital I/O pad, compatible with I
output functionality. When power is switched off, this pin connected to the I
Open-drain configuration applies to all functions on this pin.
Pad provides digital I/O and USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and
Low-speed mode only). This pad is not 5 V tolerant.
5 V tolerant pad with 5 ns glitch filter providing digital I/O functions with TTL levels and hysteresis.
5 V tolerant pad with TTL levels and hysteresis. Internal pull-up and pull-down resistors disabled.
5 V tolerant pad with TTL levels and hysteresis and internal pull-up resistor.
5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis.
is preferred to reduce susceptibility to noise). XTAL2 should be left floating.
All information provided in this document is subject to legal disclaimers.
DD(REG)(3V3)
Rev. 6.01 — 11 March 2011
2
C-bus 400 kHz specification. This pad requires an external pull-up to provide
and leave RTCX1 floating.
LPC1769/68/67/66/65/64/63
2
C-bus is floating and does not disturb the I
32-bit ARM Cortex-M3 microcontroller
© NXP B.V. 2011. All rights reserved.
2
C lines.
17 of 79

Related parts for LPC1766FBD100,551