LPC1766FBD100,551 NXP Semiconductors, LPC1766FBD100,551 Datasheet - Page 41

IC ARM CORTEX MCU 256K 100-LQFP

LPC1766FBD100,551

Manufacturer Part Number
LPC1766FBD100,551
Description
IC ARM CORTEX MCU 256K 100-LQFP
Manufacturer
NXP Semiconductors
Series
LPC17xxr
Datasheets

Specifications of LPC1766FBD100,551

Program Memory Type
FLASH
Program Memory Size
256KB (256K x 8)
Package / Case
100-LQFP
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
100MHz
Connectivity
CAN, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
70
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 3.6 V
Data Converters
A/D 8x12b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC17
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
CAN, I2C, SPI, UART
Maximum Clock Frequency
100 MHz
Number Of Programmable I/os
70
Number Of Timers
3
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB1760, MCB1760U, MCB1760UME
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 8 Channel
On-chip Dac
10 bit
Cpu Family
LPC17xx
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
100MHz
Total Internal Ram Size
64KB
# I/os (max)
70
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2.4V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
100
Package Type
LQFP
Package
100LQFP
Family Name
LPC1700
Maximum Speed
100 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4795
935287917551

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NXP Semiconductors
LPC1769_68_67_66_65_64_63
Product data sheet
7.30.5 AHB multilayer matrix
7.30.6 External interrupt inputs
7.30.7 Memory mapping control
7.31 Emulation and debugging
The LPC17xx use an AHB multilayer matrix. This matrix connects the instruction (I-code)
and data (D-code) CPU buses of the ARM Cortex-M3 to the flash memory, the main
(32 kB) static RAM, and the Boot ROM. The GPDMA can also access all of these
memories. The peripheral DMA controllers, Ethernet, and USB can access all SRAM
blocks. Additionally, the matrix connects the CPU system bus and all of the DMA
controllers to the various peripheral functions.
The LPC17xx include up to 46 edge sensitive interrupt inputs combined with up to four
level sensitive external interrupt inputs as selectable pin functions. The external interrupt
inputs can optionally be used to wake up the processor from Power-down mode.
The Cortex-M3 incorporates a mechanism that allows remapping the interrupt vector table
to alternate locations in the memory map. This is controlled via the Vector Table Offset
Register contained in the NVIC.
The vector table may be located anywhere within the bottom 1 GB of Cortex-M3 address
space. The vector table must be located on a 128 word (512 byte) boundary because the
NVIC on the LPC17xx is configured for 128 total interrupts.
Debug and trace functions are integrated into the ARM Cortex-M3. Serial wire debug and
trace functions are supported in addition to a standard JTAG debug and parallel trace
functions. The ARM Cortex-M3 is configured to support up to eight breakpoints and four
watch points.
All information provided in this document is subject to legal disclaimers.
Rev. 6.01 — 11 March 2011
LPC1769/68/67/66/65/64/63
32-bit ARM Cortex-M3 microcontroller
© NXP B.V. 2011. All rights reserved.
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