LPC1766FBD100,551 NXP Semiconductors, LPC1766FBD100,551 Datasheet - Page 70

IC ARM CORTEX MCU 256K 100-LQFP

LPC1766FBD100,551

Manufacturer Part Number
LPC1766FBD100,551
Description
IC ARM CORTEX MCU 256K 100-LQFP
Manufacturer
NXP Semiconductors
Series
LPC17xxr
Datasheets

Specifications of LPC1766FBD100,551

Program Memory Type
FLASH
Program Memory Size
256KB (256K x 8)
Package / Case
100-LQFP
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
100MHz
Connectivity
CAN, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
70
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 3.6 V
Data Converters
A/D 8x12b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC17
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
CAN, I2C, SPI, UART
Maximum Clock Frequency
100 MHz
Number Of Programmable I/os
70
Number Of Timers
3
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB1760, MCB1760U, MCB1760UME
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 8 Channel
On-chip Dac
10 bit
Cpu Family
LPC17xx
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
100MHz
Total Internal Ram Size
64KB
# I/os (max)
70
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2.4V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
100
Package Type
LQFP
Package
100LQFP
Family Name
LPC1700
Maximum Speed
100 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4795
935287917551

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NXP Semiconductors
LPC1769_68_67_66_65_64_63
Product data sheet
14.4 Standard I/O pin configuration
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of C
accordingly to the increase in parasitics of the PCB layout.
Figure 35
The default configuration for standard I/O pins is input with pull-up enabled. The weak
MOS devices provide a drive capability equivalent to pull-up and pull-down resistors.
Fig 35. Standard I/O pin configuration with analog input
as digital output
as analog input
as digital input
pin configured
pin configured
pin configured
Digital output driver: Open-drain mode enabled/disabled
Digital input: Pull-up enabled/disabled
Digital input: Pull-down enabled/disabled
Digital input: Repeater mode enabled/disabled
Analog input
driver
shows the possible pin modes for standard I/O pins with analog input function:
All information provided in this document is subject to legal disclaimers.
open-drain enable
repeater mode
output enable
analog input
Rev. 6.01 — 11 March 2011
data output
data input
enable
LPC1769/68/67/66/65/64/63
pull-down enable
pull-up enable
select analog input
x1
and C
32-bit ARM Cortex-M3 microcontroller
x2
should be chosen smaller
V
V
DD
DD
strong
pull-up
strong
pull-down
weak
pull-up
weak
pull-down
© NXP B.V. 2011. All rights reserved.
V
ESD
DD
ESD
V
SS
002aaf272
70 of 79
PIN

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