LPC1758FBD80,551 NXP Semiconductors, LPC1758FBD80,551 Datasheet - Page 38

IC ARM CORTEX MCU 512K 80-LQFP

LPC1758FBD80,551

Manufacturer Part Number
LPC1758FBD80,551
Description
IC ARM CORTEX MCU 512K 80-LQFP
Manufacturer
NXP Semiconductors
Series
LPC17xxr
Datasheets

Specifications of LPC1758FBD80,551

Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
80-LQFP
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
100MHz
Connectivity
CAN, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
52
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 3.6 V
Data Converters
A/D 6x12b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC17
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
CAN, I2C, SPI, UART
Maximum Clock Frequency
100 MHz
Number Of Programmable I/os
52
Number Of Timers
3
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
OM11036
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 6 Channel
On-chip Dac
10 bit
Package
80LQFP
Device Core
ARM Cortex M3
Family Name
LPC17xx
Maximum Speed
100 MHz
Cpu Family
LPC17xx
Device Core Size
32b
Frequency (max)
100MHz
Total Internal Ram Size
64KB
# I/os (max)
52
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2.4/2.7V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
80
Package Type
LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4792
935288607551

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC1758FBD80,551
Quantity:
9 999
Part Number:
LPC1758FBD80,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
9. Thermal characteristics
Table 5.
V
LPC1759_58_56_54_52_51
Product data sheet
Symbol
T
DD
j(max)
= 2.4 V to 3.6 V; T
Thermal characteristics
Parameter
maximum junction
temperature
9.1 Thermal characteristics
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
=
J
=
T
R
P
40
amb
D
th(j-a)
T
amb
°
= sum of internal and I/O power dissipation
C to +85
= ambient temperature (°C),
= the package junction-to-ambient thermal resistance (°C/W)
+
(
P
D
All information provided in this document is subject to legal disclaimers.
°
Conditions
×
C unless otherwise specified;
R
th j a
(
Rev. 6.01 — 11 March 2011
)
)
LPC1759/58/56/54/52/51
J
(°C), can be calculated using the following
Min
-
DD
32-bit ARM Cortex-M3 microcontroller
and V
DD
Typ
-
. The I/O power dissipation of
Max
125
© NXP B.V. 2011. All rights reserved.
Unit
°C
38 of 74
(1)

Related parts for LPC1758FBD80,551