MCU 32KB FLASH EEPROM 32-VFQFPN

STM8S105K6U6

Manufacturer Part NumberSTM8S105K6U6
DescriptionMCU 32KB FLASH EEPROM 32-VFQFPN
ManufacturerSTMicroelectronics
SeriesSTM8S
STM8S105K6U6 datasheet
 

Specifications of STM8S105K6U6

Core ProcessorSTM8Core Size8-Bit
Speed16MHzConnectivityI²C, IrDA, LIN, SPI, UART/USART
PeripheralsBrown-out Detect/Reset, POR, PWM, WDTNumber Of I /o25
Program Memory Size32KB (32K x 8)Program Memory TypeFLASH
Eeprom Size1K x 8Ram Size2K x 8
Voltage - Supply (vcc/vdd)2.95 V ~ 5.5 VData ConvertersA/D 7x10b
Oscillator TypeInternalOperating Temperature-40°C ~ 85°C
Package / Case32-VFQFN, 32-VFQFPNProcessor SeriesSTM8S10x
CoreSTM8Data Bus Width8 bit
Data Ram Size2 KBInterface TypeI2C, SPI, UART
Maximum Clock Frequency16 MHzNumber Of Programmable I/os25
Number Of Timers8Maximum Operating Temperature+ 85 C
Mounting StyleSMD/SMT3rd Party Development ToolsEWSTM8
Development Tools By SupplierSTICE-SYS001Minimum Operating Temperature- 40 C
On-chip Adc10 bit, 7 ChannelFor Use With497-10040 - EVAL KIT STM8S DISCOVERY497-10593 - KIT STARTER FOR STM8S207/8 SER
Lead Free Status / RoHS StatusLead free / RoHS CompliantOther names497-10123
STM8S105K6U6
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STM8S105xx
11.5
32-lead UFQFPN package mechanical data
Figure 51: 32-lead, ultra thin, fine pitch quad flat no-lead package (5 x 5)
1. Drawing is not to scale.
2. All leads/pads should be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended
to connect and solder this backside pad to PCB ground.
4. Dimensions are in millimeters.
Table 56: 32-lead, ultra thin, fine pitch quad flat no-lead package mechanical data
Dim.
mm
Min
A
0.500
A1
0
A3
b
0.180
inches
Typ
Max
Min
0.550
0.600
0.0197
0.020
0.050
0.200
0.250
0.300
0.0071
DocID14771 Rev 10
Package information
AOB8_ME
(1)
Typ
Max
0.0217
0.0236
0.0008
0.0020
0.0079
0.0098
0.0118
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