STM32F101R6T6 STMicroelectronics, STM32F101R6T6 Datasheet - Page 14

• Manufacturer Part Number: STM32F101R6T6
• Description: MCU ARM 32KB FLASH/TIMER 64-LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F101R6T6

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 36MHz
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 51
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 6K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-LQFP
• For Use With: 497-8853 - BOARD DEMO STM32 UNIV USB-UUSCIKSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8505 - KIT STARTER FOR STM32F10XE MCU497-8304 - KIT STM32 MOTOR DRIVER BLDC497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Other names: 497-6057

Description
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Full compatibility throughout the family
The STM32F101xx is a complete family whose members are fully pin-to-pin, software and
feature compatible. In the reference manual, the STM32F101x4 and STM32F101x6 are
referred to as low-density devices, the STM32F101x8 and STM32F101xB are referred to as
medium-density devices, and the STM32F101xC, STM32F101xD and STM32F101xE are
referred to as high-density devices.
Low- and high-density devices are an extension of the STM32F101x8/B devices, they are
specified in the STM32F101x4/6 and STM32F101xC/D/E datasheets, respectively. Low-
density devices feature lower Flash memory and RAM capacities and a timer less. High-
density devices have higher Flash memory and RAM capacities, and additional peripherals
like FSMC and DAC, while remaining fully compatible with the other members of the
STM32F101xx family.
The STM32F101x4, STM32F101x6, STM32F101xC, STM32F101xD and STM32F101xE
are a drop-in replacement for the STM32F101x8/B medium-density devices, allowing the
user to try different memory densities and providing a greater degree of freedom during the
development cycle.
Moreover, the STM32F101xx performance line family is fully compatible with all existing
STM32F101xx access line and STM32F102xx USB access line devices.
Table 3.
1. For orderable part numbers that do not show the A internal code after the temperature range code (6), the
Pinout
144
100
64
48
36
reference datasheet for electrical characteristics is that of the STM32F101x8/B medium-density devices.
4 KB RAM 6 KB RAM 10 KB RAM 16 KB RAM
2 × USARTs
2 × 16-bit timers
1 × SPI, 1 × I
1 × ADC
Low-density devices
16 KB
Flash
STM32F101xx family
2
Flash
C
32 KB
(1)
Doc ID 15058 Rev 5
3 × USARTs
3 × 16-bit timers
2 × SPIs, 2 × I2Cs,
1 × ADC
Medium-density devices
64 KB
Flash
Memory size
128 KB
Flash
5 × USARTs
4 × 16-bit timers, 2 × basic timers
3 × SPIs, 2 × I
2 × DACs, FSMC (100 and 144 pins)
256 KB
32 KB
Flash
RAM
STM32F101x4, STM32F101x6
High-density devices
2
384 KB
Cs, 1 × ADC,
48 KB
Flash
RAM
512 KB
48 KB
Flash
RAM