ST62T25CB6 STMicroelectronics, ST62T25CB6 Datasheet - Page 81

• Manufacturer Part Number: ST62T25CB6
• Description: IC MCU 8BIT OTP 4K 28 PDIP
• Manufacturer: STMicroelectronics
• Series: ST6r

Specifications of ST62T25CB6

• Core Processor: ST6
• Core Size: 8-Bit
• Speed: 8MHz
• Peripherals: LVD, POR, WDT
• Number Of I /o: 20
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: OTP
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 6 V
• Data Converters: A/D 16x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-DIP (0.600", 15.24mm)
• Processor Series: ST62T2x
• Core: ST6
• Data Bus Width: 8 bit
• Data Ram Size: 64 B
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 20
• Number Of Timers: 1
• Operating Supply Voltage: 3 V to 6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Development Tools By Supplier: ST62GP-EMU2, ST62E2XC-EPB/110, ST62E6XC-EPB/US, ST622XC-KIT/110, STREALIZER-II
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16-ch x 8-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-2100-5

EMC CHARACTERISTICS (Cont’d)
11.7.3 ESD Pin Protection Strategy
To protect an integrated circuit against Electro-
Static Discharge the stress must be controlled to
prevent degradation or destruction of the circuit el-
ements. The stress generally affects the circuit el-
ements which are connected to the pads but can
also affect the internal devices when the supply
pads receive the stress. The elements to be pro-
tected must not receive excessive current, voltage
or heating within their structure.
An ESD network combines the different input and
output ESD protections. This network works, by al-
lowing safe discharge paths for the pins subjected
to ESD stress. Two critical ESD stress cases are
presented in
pins.
Figure 59. Positive Stress on a Standard Pad vs. V
Figure 60. Negative Stress on a Standard Pad vs. V
Main path
Path to avoid
Main path
Figure 59
V
V
V
V
DD
DD
SS
SS
and
Figure 60
(3a)
(3b)
(3a)
(3b)
for standard
OUT
OUT
SS
Standard Pin Protection
To protect the output structure the following ele-
ments are added:
– A diode to V
– A protection device between V
To protect the input structure the following ele-
ments are added:
– A resistor in series with the pad (1)
– A diode to V
– A protection device between V
DD
(4)
(4)
ST6215CM-Auto ST6225CM-Auto
IN
IN
DD
DD
(3a) and a diode from V
(2a) and a diode from V
(2a)
(2b)
(2a)
(2b)
(1)
(1)
DD
DD
and V
and V
SS
SS
SS
SS
81/100
V
V
V
V
(3b)
(2b)
(4)
(4)
DD
SS
DD
SS
1