STM32F101T4U6A STMicroelectronics, STM32F101T4U6A Datasheet - Page 74

• Manufacturer Part Number: STM32F101T4U6A
• Description: MCU ARM 32BIT 16K FLASH 36VFQFPN
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F101T4U6A

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 36MHz
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 26
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 36-VFQFN, 36-VFQFPN
• For Use With: 497-10030 - STARTER KIT FOR STM32497-8853 - BOARD DEMO STM32 UNIV USB-UUSCIKSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8505 - KIT STARTER FOR STM32F10XE MCU497-8304 - KIT STM32 MOTOR DRIVER BLDC497-6438 - BOARD EVALUTION FOR STM32 512K497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 497-8315

Package characteristics
6.2
6.2.1
74/79
Thermal characteristics
The maximum chip junction temperature (T
Table 8: General operating conditions on page
The maximum chip-junction temperature, T
using the following equation:
Where:
●
●
●
●
P
taking into account the actual V
application.
Table 51.
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
I/O
Symbol
Θ
max represents the maximum power dissipation on output pins where:
T
Θ
P
P
internal power.
P
JA
A
D
INT
I/O
JA
max is the maximum ambient temperature in °C,
max is the sum of P
is the package junction-to-ambient thermal resistance, in °C/W,
max = Σ (V
max is the product of I
Thermal resistance junction-ambient
LQFP 64 - 10 x 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP 48 - 7 x 7 mm / 0.5 mm pitch
Thermal resistance junction-ambient
VFQFPN 48 - 7 x 7 mm / 0.5 mm pitch
Thermal resistance junction-ambient
VFQFPN 36 - 6 x 6 mm / 0.5 mm pitch
Package thermal characteristics
OL
× I
OL
INT
T
) + Σ((V
Parameter
J
Doc ID 15058 Rev 5
max = T
OL
max and P
DD
/ I
and V
DD
OL
– V
A
and V
max + (P
DD
OH
I/O
J
J
, expressed in Watts. This is the maximum chip
max) must never exceed the values given in
max, in degrees Celsius, may be calculated
OH
) × I
max (P
30.
/ I
OH
D
OH
),
max x Θ
D
of the I/Os at low and high level in the
max = P
STM32F101x4, STM32F101x6
JA
)
INT
Value
45
55
16
18
max + P
I/O
max),
°C/W
Unit