STM32F101T4U6A STMicroelectronics, STM32F101T4U6A Datasheet - Page 77

MCU ARM 32BIT 16K FLASH 36VFQFPN

STM32F101T4U6A

Manufacturer Part Number
STM32F101T4U6A
Description
MCU ARM 32BIT 16K FLASH 36VFQFPN
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F101T4U6A

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
36MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
26
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
36-VFQFN, 36-VFQFPN
For Use With
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
497-8315

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STM32F101x4, STM32F101x6
8
Revision history
Table 53.
23-Sep-2008
24-Sep-2009
07-Apr-2009
Date
Document revision history
Revision
1
2
3
Initial release.
I/O information clarified
In
PB15, PB3/TRACESWO moved from Default column to Remap column.
V
Low-density access line block
and
to V
Note modified in
code with data processing running from Flash
current consumption in Sleep mode, code running from Flash or
Figure
ACC
Small text changes.
Note 5
STM32F101xx pin
V
voltage. Typical I
current consumptions in Stop and Standby
current consumption on VBAT with RTC on versus temperature at
different VBAT values
f
characteristics.
C
characteristics
32.768
Note 1
crystal.
Table 23: HSI oscillator characteristics
from
Figure 27: Recommended NRST pin protection
IEC 1000 standard updated to IEC 61000 and SAE J1752/3 updated to
IEC 61967-2 in
Jitter added to
C
R
Small text changes.
Figure 30: Power supply and reference decoupling (V
HSE_ext
REF-
RERINT
L1
ADC
AIN
Table 4: Low-density STM32F101xx pin
DDA
and C
Figure 34: Power supply and reference decoupling
HSI
Table 25: Low-power mode wakeup
max values modified in
Doc ID 15058 Rev 5
and R
is not available in the offered packages:
15,
updated and
modified below
kHz), notes modified and moved below the tables.
)
max values modified in
min modified in
and T
removed.
L2
Figure 16
AIN
replaced by C in
Coeff
and
Table 26: PLL
Section 5.3.10: EMC characteristics on page
parameters modified in
DD_VBAT
Table 12: Maximum current consumption in Run mode,
definitions.
Table 22: LSE oscillator characteristics (fLSE =
added to
Note 4
and
added.
Figure 20: Typical application with an 8 MHz
on page
Table 19: High-speed external user clock
value added in
Figure 17
added in
Table 43: RAIN max for fADC = 14
Table 11: Embedded internal reference
characteristics.
Table 21: HSE 4-16 MHz oscillator
diagram,
Changes
Table 23: HSI oscillator
1.
Figure 7: Memory map
show typical curves.
Table 4: Low-density
modified. Conditions removed
Figure 10: Power supply scheme
Table 42: ADC
Table 15: Typical and maximum
timings.
definitions: PB4, PB13, PB14,
modes.
Figure 1: STM32F101xx
and
modified.
Table 14: Maximum
Figure 14: Typical
REF+
Revision history
characteristics.
updated,
characteristics.
not connected
modified.
48.
MHz.
RAM.
77/79

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