STM32F101C4T6A STMicroelectronics, STM32F101C4T6A Datasheet - Page 77

MCU ARM 32BIT 16K FLASH 48-LQFP

STM32F101C4T6A

Manufacturer Part Number
STM32F101C4T6A
Description
MCU ARM 32BIT 16K FLASH 48-LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F101C4T6A

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
36MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
37
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-LQFP
Processor Series
STM32F101x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
4 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
36 MHz
Number Of Programmable I/os
37
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 10 Channel
For Use With
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
497-8313

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STM32F101x4, STM32F101x6
8
Revision history
Table 53.
23-Sep-2008
24-Sep-2009
07-Apr-2009
Date
Document revision history
Revision
1
2
3
Initial release.
I/O information clarified
In
PB15, PB3/TRACESWO moved from Default column to Remap column.
V
Low-density access line block
and
to V
Note modified in
code with data processing running from Flash
current consumption in Sleep mode, code running from Flash or
Figure
ACC
Small text changes.
Note 5
STM32F101xx pin
V
voltage. Typical I
current consumptions in Stop and Standby
current consumption on VBAT with RTC on versus temperature at
different VBAT values
f
characteristics.
C
characteristics
32.768
Note 1
crystal.
Table 23: HSI oscillator characteristics
from
Figure 27: Recommended NRST pin protection
IEC 1000 standard updated to IEC 61000 and SAE J1752/3 updated to
IEC 61967-2 in
Jitter added to
C
R
Small text changes.
Figure 30: Power supply and reference decoupling (V
HSE_ext
REF-
RERINT
L1
ADC
AIN
Table 4: Low-density STM32F101xx pin
DDA
and C
Figure 34: Power supply and reference decoupling
HSI
Table 25: Low-power mode wakeup
max values modified in
Doc ID 15058 Rev 5
and R
is not available in the offered packages:
15,
updated and
modified below
kHz), notes modified and moved below the tables.
)
max values modified in
min modified in
and T
removed.
L2
Figure 16
AIN
replaced by C in
Coeff
and
Table 26: PLL
Section 5.3.10: EMC characteristics on page
parameters modified in
DD_VBAT
Table 12: Maximum current consumption in Run mode,
definitions.
Table 22: LSE oscillator characteristics (fLSE =
added to
Note 4
and
added.
Figure 20: Typical application with an 8 MHz
on page
Table 19: High-speed external user clock
value added in
Figure 17
added in
Table 43: RAIN max for fADC = 14
Table 11: Embedded internal reference
characteristics.
Table 21: HSE 4-16 MHz oscillator
diagram,
Changes
Table 23: HSI oscillator
1.
Figure 7: Memory map
show typical curves.
Table 4: Low-density
modified. Conditions removed
Figure 10: Power supply scheme
Table 42: ADC
Table 15: Typical and maximum
timings.
definitions: PB4, PB13, PB14,
modes.
Figure 1: STM32F101xx
and
modified.
Table 14: Maximum
Figure 14: Typical
REF+
Revision history
characteristics.
updated,
characteristics.
not connected
modified.
48.
MHz.
RAM.
77/79

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