STM32F101T8U6 STMicroelectronics, STM32F101T8U6 Datasheet - Page 83

MCU ARM 32BIT 64K FLASH 36VFQFPN

STM32F101T8U6

Manufacturer Part Number
STM32F101T8U6
Description
MCU ARM 32BIT 64K FLASH 36VFQFPN
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F101T8U6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
36MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
26
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
10K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
36-VFQFN, 36-VFQFPN
Controller Family/series
(ARM Cortex) STM32
No. Of I/o's
26
Ram Memory Size
10KB
Cpu Speed
36MHz
No. Of Timers
3
Embedded Interface Type
I2C, SPI, USART
Rohs Compliant
Yes
Processor Series
STM32F101x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
10 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
36 MHz
Number Of Programmable I/os
26
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 10 Channel
For Use With
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
497-9032
STM32F101T8U6

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STM32F101x8, STM32F101xB
Table 54.
22-May-2008
14-Mar-2008
21-Mar-2008
Date
Document revision history (continued)
Revision
5
6
7
Figure 2: Clock tree on page 13
CRC added (see
page 9
Maximum T
P
in
I
Stop and Standby modes on page
ACC
note 2 removed.
t
V
page
Table 41: SPI characteristics on page 63
I
Table 44: ADC accuracy - limited test conditions
Section 6.2: Thermal characteristics on page 77
Appendix A: Important notes
Small text changes.
In
– N
– cycling conditions specified for t
– t
Figure 2: Clock tree
V
CRC feature removed.
Section 1: Introduction
throughout the family
I
mode on page
Values added to
V) on page
Figure 30: SPI timing diagram - slave mode and CPHA = 0 on page 64
modified.
Section 6.2.2: Evaluating the maximum junction temperature for an
application on page 78
Axx option added to
accuracy
LQFP100 package specifications updated (see
characteristics on page
Recommended LQFP100, LQFP64, LQFP48 and VFQFPN36 footprints
added (see
DD
RET
VREF
DD_VBAT
D
NF(NRST)
25
Table 27: Flash memory characteristics on page
Table 28: Flash memory endurance and data
, T
RET
, Avg_Slope and T
END
modified in
HSI
Doc ID 13586 Rev 14
modified in
A
59.
added in
and T
min modified at T
and
tested over the whole temperature range
modified in
removed from
modified.
Equation 1
unit corrected in
62.
J
Figure 8: Memory map on page 28
Figure
J
value given in
added, t
42.
Table 15: Typical and maximum current consumptions in
Table 42: ADC characteristics on page
Table 28: Flash memory endurance and data
Table 40: SCL frequency (fPCLK1= 36 MHz, VDD = 3.3
CRC (cyclic redundancy check) calculation unit on
42,
Table 23: HSI oscillator characteristics on page
corrected.
Table 53: Ordering information scheme on page
corrected.
added. CRC feature added.
L
prog
Figure
modified,
Table 21: Typical current consumption in Standby
added.
modified in
71).
A
= 55 °C
values modified and t
Table 37: NRST pin characteristics on
Table 7: Thermal characteristics on page
removed.
44,
Figure 8: Memory map
Changes
added.
Section 2.2: Full compatibility
Figure 46
RET
38.
Table 46: TS
modified.
and
for address).
Section 6: Package
prog
retention:
Figure
added.
characteristics.
modified.
50.
description clarified
Revision history
66.
clarified.
40).
Table 45: ADC
retention.
48,
83/87
32.
79.

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