STM32F101R8T6 STMicroelectronics, STM32F101R8T6 Datasheet - Page 73

• Manufacturer Part Number: STM32F101R8T6
• Description: MCU ARM 64KB FLASH/TIMER 64-LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F101R8T6

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 36MHz
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 51
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 10K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-LQFP
• Processor Series: STM32F101x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 10 KB
• Interface Type: I2C/SPI/USART
• Maximum Clock Frequency: 36 MHz
• Number Of Programmable I/os: 51
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16-ch x 12-bit
• For Use With: 497-10030 - STARTER KIT FOR STM32497-8853 - BOARD DEMO STM32 UNIV USB-UUSCIKSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8505 - KIT STARTER FOR STM32F10XE MCU497-8304 - KIT STM32 MOTOR DRIVER BLDC497-6438 - BOARD EVALUTION FOR STM32 512K497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-6058

STM32F101x8, STM32F101xB
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead solder joint life.
Table 48.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
A
A1
A2
A3
b
D
D2
E
E2
e
L
ddd
Figure 39. VFQFPN36 6 x 6 mm, 0.5 mm pitch, package
Pin # 1 ID
R = 0.20
Symbol
Seating plane
D
C
e
A3
28
36
VFQFPN36 6 x 6 mm, 0.5 mm pitch, package mechanical data
outline
27
1
0.800
0.180
5.875
1.750
5.875
1.750
0.450
0.350
Min
(1)
b
E2
E
millimeters
0.900
0.020
0.650
0.250
0.230
6.000
3.700
6.000
3.700
0.500
0.550
0.080
9
Typ
19
18
10
A1
D2
Doc ID 13586 Rev 14
A2
L
A
1.000
0.050
1.000
0.300
6.125
4.250
6.125
4.250
0.550
0.750
Max
ddd C
ZR_ME
Figure 40. Recommended footprint
0.0315
0.0071
0.2313
0.0689
0.2313
0.0689
0.0177
0.0138
4.30
Min
28
36
27
1
(dimensions in mm)
4.80
inches
Package characteristics
0.0354
0.0008
0.0256
0.0098
0.0091
0.2362
0.1457
0.2362
0.1457
0.0197
0.0217
0.0031
4.10
Typ
4.80
4.30
6.30
(1)
4.10
0.30
19
9
1.00
0.0394
0.0020
0.0394
0.0118
0.2411
0.1673
0.2411
0.1673
0.0217
0.0295
18
10
Max
(1)(2)
0.75
0.50
ai14870b
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