C8051F046-GQ Silicon Laboratories Inc, C8051F046-GQ Datasheet - Page 177

• Manufacturer Part Number: C8051F046-GQ
• Description: IC 8051 MCU 32K FLASH 100TQFP
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F04xr

Specifications of C8051F046-GQ

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: CAN, EBI/EMI, SMBus (2-Wire/I²C), SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
• Number Of I /o: 64
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 4.25K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 13x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP, 100-VQFP
• Processor Series: C8051F0x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 4.25 KB
• Interface Type: CAN, SMBus, SPI, UART
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 64
• Number Of Timers: 5
• Operating Supply Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F040DK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 13 Channel
• On-chip Dac: 12 bit, 2 Channel
• Package: 100TQFP
• Device Core: 8051
• Family Name: C8051F04x
• Maximum Speed: 25 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 336-1211

14.4. External Crystal Example
If a crystal or ceramic resonator is used as an external oscillator source for the MCU, the circuit should be
configured as shown in Figure 14.1, Option 1. The External Oscillator Frequency Control value (XFCN)
should be chosen from the Crystal column of the table in SFR Definition 14.4 (OSCXCN register). For
example, an 11.0592 MHz crystal requires an XFCN setting of 111b.
When the crystal oscillator is enabled, the oscillator amplitude detection circuit requires a settle time to
achieve proper bias. Introducing a delay of at least 1 ms between enabling the oscillator and checking the
XTLVLD bit will prevent a premature switch to the external oscillator as the system clock. Switching to the
external oscillator before the crystal oscillator has stabilized can result in unpredictable behavior. The rec-
ommended procedure is:
Note: Tuning-fork crystals may require additional settling time before XTLVLD returns a valid result.
The capacitors shown in the external crystal configuration provide the load capacitance required by the
crystal for correct oscillation. These capacitors are "in series" as seen by the crystal and "in parallel" with
the stray capacitance of the XTAL1 and XTAL2 pins.
Note: The load capacitance depends upon the crystal and the manufacturer. Please refer to the crystal
data sheet when completing these calculations.
For example, a tuning-fork crystal of 32.768 kHz with a recommended load capacitance of 12.5 pF should
use the configuration shown in Figure 14.1, Option 1. The total value of the capacitors and the stray capac-
itance of the XTAL pins should equal 25 pF. With a stray capacitance of 3 pF per pin, the 22 pF capacitors
yield an equivalent capacitance of 12.5 pF across the crystal, as shown in Figure 14.2.
Important Note on External Crystals: Crystal oscillator circuits are quite sensitive to PCB layout. The
crystal should be placed as close as possible to the XTAL pins on the device. The traces should be as
short as possible and shielded with ground plane from any other traces which could introduce noise or
interference.
Step 1. Enable the external oscillator in crystal oscillator mode.
Step 2. Wait at least 1 ms.
Step 3. Poll for XTLVLD => '1'.
Step 4. Switch the system clock to the external oscillator.
Figure 14.2. 32.768 kHz External Crystal Example
32.768 kHz
22 pF
22 pF
Rev. 1.5
C8051F040/1/2/3/4/5/6/7
10 M

XTAL1
XTAL2
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