C8051F022-GQ Silicon Laboratories Inc, C8051F022-GQ Datasheet - Page 162

• Manufacturer Part Number: C8051F022-GQ
• Description: IC 8051 MCU 64K FLASH 100TQFP
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F02xr

Specifications of C8051F022-GQ

• Program Memory Type: FLASH
• Program Memory Size: 64KB (64K x 8)
• Package / Case: 100-TQFP, 100-VQFP
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, SMBus (2-Wire/I²C), SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
• Number Of I /o: 64
• Ram Size: 4.25K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x8b, 8x10b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: C8051F0x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 4.25 KB
• Interface Type: I2C/SMBus/SPI/UART
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 64
• Number Of Timers: 4
• Operating Supply Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F020DK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 8-bit or 8-ch x 10-bit
• On-chip Dac: 2-ch x 12-bit
• No. Of I/o's: 64
• Ram Memory Size: 4352Byte
• Cpu Speed: 25MHz
• No. Of Timers: 5
• Rohs Compliant: Yes
• Cpu Family: C8051F02x
• Device Core: 8051
• Device Core Size: 8b
• Frequency (max): 25MHz
• Total Internal Ram Size: 4.25KB
• # I/os (max): 64
• Number Of Timers - General Purpose: 5
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 2.7V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: TQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 336-1200 - DEV KIT FOR F020/F021/F022/F023
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1202

C8051F020/1/2/3
The C8051F020/1/2/3 devices have a wide array of digital resources which are available through the four lower I/O
Ports: P0, P1, P2, and P3. Each of the pins on P0, P1, P2, and P3, can be defined as a General-Purpose I/O (GPIO) pin
or can be controlled by a digital peripheral or function (like UART0 or /INT1 for example), as shown in Figure 17.2.
The system designer controls which digital functions are assigned pins, limited only by the number of pins available.
This resource assignment flexibility is achieved through the use of a Priority Crossbar Decoder. Note that the state of
a Port I/O pin can always be read from its associated Data register regardless of whether that pin has been assigned to
a digital peripheral or behaves as GPIO. The Port pins on Port 1 can be used as Analog Inputs to ADC1.
An External Memory Interface which is active during the execution of a MOVX instruction whose target address
resides in off-chip memory can be active on either the lower Ports or the upper Ports. See
DATA MEMORY INTERFACE AND ON-CHIP XRAM” on page 145
Memory Interface.
The upper Ports (available on C8051F020/2) can be byte-accessed as GPIO pins.
162
Highest
Priority
Lowest
Priority
Latches
Port
T2, T2EX,
/SYSCLK
CNVSTR
T4,T4EX
Comptr.
Outputs
UART0
UART1
SMBus
T0, T1,
/INT0,
/INT1
PCA
P0
P1
P2
P3
SPI
(P0.0-P0.7)
(P1.0-P1.7)
(P2.0-P2.7)
(P3.0-P3.7)
Figure 17.2. Lower Port I/O Functional Block Diagram
8
8
8
8
2
4
2
2
6
2
8
XBR2, P1MDIN
XBR0, XBR1,
Crossbar
Decoder
To External
Registers
Priority
Rev. 1.4
Digital
Interface
Memory
(EMIF)
8
8
8
8
P0MDOUT, P1MDOUT,
P2MDOUT, P3MDOUT
Registers
for more information about the External
ADC1
Input
Cells
Cells
Cells
Cells
To
I/O
I/O
I/O
I/O
P0
P1
P2
P3
Section “16. EXTERNAL
External
Pins
P0.0
P0.7
P1.0
P1.7
P2.0
P2.7
P3.0
P3.7
Highest
Lowest
Priority
Priority