C8051F022-GQ Silicon Laboratories Inc, C8051F022-GQ Datasheet - Page 265

• Manufacturer Part Number: C8051F022-GQ
• Description: IC 8051 MCU 64K FLASH 100TQFP
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F02xr

Specifications of C8051F022-GQ

• Program Memory Type: FLASH
• Program Memory Size: 64KB (64K x 8)
• Package / Case: 100-TQFP, 100-VQFP
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, SMBus (2-Wire/I²C), SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
• Number Of I /o: 64
• Ram Size: 4.25K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x8b, 8x10b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: C8051F0x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 4.25 KB
• Interface Type: I2C/SMBus/SPI/UART
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 64
• Number Of Timers: 4
• Operating Supply Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F020DK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 8-bit or 8-ch x 10-bit
• On-chip Dac: 2-ch x 12-bit
• No. Of I/o's: 64
• Ram Memory Size: 4352Byte
• Cpu Speed: 25MHz
• No. Of Timers: 5
• Rohs Compliant: Yes
• Cpu Family: C8051F02x
• Device Core: 8051
• Device Core Size: 8b
• Frequency (max): 25MHz
• Total Internal Ram Size: 4.25KB
• # I/os (max): 64
• Number Of Timers - General Purpose: 5
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 2.7V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: TQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 336-1200 - DEV KIT FOR F020/F021/F022/F023
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1202

24.
Each MCU has an on-chip JTAG interface and logic to support boundary scan for production and in-system testing,
Flash read/write operations, and non-intrusive in-circuit debug. The JTAG interface is fully compliant with the IEEE
1149.1 specification. Refer to this specification for detailed descriptions of the Test Interface and Boundary-Scan
Architecture. Access of the JTAG Instruction Register (IR) and Data Registers (DR) are as described in the Test
Access Port and Operation of the IEEE 1149.1 specification.
The JTAG interface is accessed via four dedicated pins on the MCU: TCK, TMS, TDI, and TDO.
Through the 16-bit JTAG Instruction Register (IR), any of the seven instructions shown in Figure 24.1 can be com-
manded. There are three DR’s associated with JTAG Boundary-Scan, and four associated with Flash read/write oper-
ations on the MCU.
Bit15
IR Value
0xFFFF
0x0000
0x0002
0x0004
0x0082
0x0083
0x0084
JTAG (IEEE 1149.1)
Flash Address
Flash Control
PRELOAD
Instruction
SAMPLE/
Flash Data
EXTEST
IDCODE
BYPASS
Figure 24.1. IR: JTAG Instruction Register
Selects the Boundary Data Register for control and observability of all device pins
Selects FLASHADR Register which holds the address of all Flash read, write, and
Selects FLASHCON Register to control how the interface logic responds to reads
Selects the Boundary Data Register for observability and presetting the scan-path
Selects FLASHDAT Register for reads and writes to the Flash memory
and writes to the FLASHDAT Register
Selects Bypass Data Register
Rev. 1.4
Selects device ID Register
erase operations
Description
latches
C8051F020/1/2/3
Bit0
Reset Value
0x0000
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