SAB-C167CR-LM HA+ Infineon Technologies, SAB-C167CR-LM HA+ Datasheet - Page 88

IC MCU 16BIT MQFP-144

SAB-C167CR-LM HA+

Manufacturer Part Number
SAB-C167CR-LM HA+
Description
IC MCU 16BIT MQFP-144
Manufacturer
Infineon Technologies
Series
C16xxr
Datasheet

Specifications of SAB-C167CR-LM HA+

Core Processor
C166
Core Size
16-Bit
Speed
25MHz
Connectivity
CAN, EBI/EMI, SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
111
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
144- BSQFP
Data Bus Width
16 bit
Data Ram Size
4 KB
Interface Type
1xUSART, 1xSSC
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
111
Number Of Timers
9
Operating Supply Voltage
5 V
Maximum Operating Temperature
+ 70 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
0 C
On-chip Adc
10 bit, 16 Channel
Packages
PG-MQFP-144
Max Clock Frequency
25.0 MHz
Sram (incl. Cache)
4.0 KByte
Can Nodes
1
A / D Input Lines (incl. Fadc)
16
Program Memory
0.0 KByte
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
 Details
Other names
B167CRLMHAZNP
B167CRLMHAZXP
SAB-C167CR-LMHA
SAB-C167CR-LMHA+
SAB-C167CR-LMHA
SAB-C167CR-LMHAIN
SABC167CRLM-HA
SABC167CRLM-HA
SABC167CRLMHAX
SP000103462
Figure 25
You can find all of our packages, sorts of packing and others in our
Infineon Internet Page “Products”: http://www.infineon.com/products.
Data Sheet
P-BGA-176-2 (Plastic Ball Grid Array Package)
A14
13 x 1 = 13
1.5
ø0.5
1
4x
15
13
±0.5
+0.14
-0.16
±0.2
±1
86
ø0.3
ø0.1
176x
P1
B
M
M
A1
A
C
Index Marking
Index Marking
(sharp edge)
A
B
C
0.2
C
Package Outlines
Dimensions in mm
V3.3, 2005-02
C167CR
C167SR
GPA09430

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